Heterogeneous package integration with ultraminiaturized high-performance components and their seamless connectivity with actives devices to form next-generation chiplet-scale 3D modulus is the key vision that drives our research. We advance next-generation bioelectronics and electronic systems in two classes:
Next-generation systems: We develop key technology building blocks to demonstrate leading-edge functional system prototypes for emerging healthcare, power, 5G, IoT and other market needs. Key system prototypes that we currently develop are:
- Wireless neural recording and stimulation
- Wireless flex photonic sensors for wearables and implantables
- Reconfigurable wireless communication
- High-power packaging
Basic packaging technologies: Advancing technology elements is the key to create next-generation systems listed above.
We focus on:
- Innovative fan-out and embedded packaging,
- 3D connectivity between system components with additive manufacturing
- Flex high-density packaging.
- Capacitors and Inductors for power and RF,
- Multiferroic and inductive power and data telemetry interfaces
Recent Highlights: Sk Yeahia Been Sayeed demonstrates the world’s smallest and thinnest passive wireless neural recording system and the first-ever wireless seismocardiogram:
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