Research Recognition Award

  1. Best paper award, IEEE Nanotechnology Materials and Devices Conference (NMDC)”, Carmine Gianfagna, Madhavan Swaminathan, P M Raj, Rao Tummala, Giulio Antonini, Enabling Antenna Design with Nano-Magnetic Materials using Machine Learning, Presented at Anchorage, Alaska, Sept 13-16, 2015
  2. Best of Track (Advanced Packaging), at the 49th International Symposium on Microelectronics, 2016, October 10th-13th in Pasadena, United States, “Electrodeposited copper-graphite composites for low-CTE integrated thermal structures”, Shreya Dwarakanath, P M Raj, Vanessa Smet, Venky Sundaram, Rao Tummala
  3. “IEEE EPTC Outstanding Technical Paper Award”, 6th Electronics Packaging Technology Conference (EPTC 2004), “High Frequency Characteristics of Supercapacitive Nanocomposite Thin Films and Their Suitability for Embedded DecouplingMarkondeya Raj, D. Balaraman, V. Govind, L.X. Wan, R. Abothu, R. Gerhardt, S. Bhattacharya, M. Swaminathan and R. Tummala, Georgia Institute of Technology, USA, 2005
  4. Finalist, best conference paper, IEEE-NANO 2014, “Tunable and Miniaturized RF Components with Nanocomposite and Nanolayered Dielectrics” M. Raj, Parthasarathi Chakraborti, Saumya Gandhi, Himani Sharma, Srikrishna Sitaraman, Kyuhwan Han, Madhavan Swaminathan and Rao Tummala
  5. “IEEE Transactions on Advanced Packaging, Commendable Paper of 2004”, “The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade”, Tummala, R.R.; Swaminathan, M.; Tentzeris, M.M.; Laskar, J.; Gee-Kung Chang; Sitaraman, S.; Keezer, D.; Guidotti, D.; Zhaoran Huang; Kyutae Lim; Lixi Wan; Bhattacharya, S.K.; Sundaram, V.; Fuhan Liu; Markondeya Raj, P
  6. Best Poster Award, IEEE Electronic Components and Technology Conference, 2011, H. Sharma, K. Sethi, M. Raj, Venky Sundaram, and Rao Tummala, “Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers
  7. Medtronic MBTS – Invention of Distinction, “Systems and methods for providing high-density capacitors”, Inventors: M. Raj, Rao Tummala, Himani sharma, Kanika Sethi (Georgia Tech., PRC), Anna Malin and Andy Fenner (Medtronic Microelectronics Corp), August 26, 2009
  8. “Philips Best Paper Award”, International Conference on Electronic Packaging Technology (ICEPT), China, August 2005, “Design, Simulation and Measurements of High-Speed Embedded Decoupling Capacitors for Multi GHz Packages/PCBs” (Lixi Wan, M. Raj, Rao Tummala and M. Swaminathan)
  9. Best Paper of the Session“, Emerging Technologies Session, Novel Low-Cost Sol-Gel Derived Nano-structured and Repairable Interconnects, 36th International Symposium on Microelectronics, Sponsored by International Microelectronics and Packaging Society (IMAPS), 2003 Boston; Ankur Aggarwal, M. Raj, Isaac Robin Abothu, Michael D. Sacks and Rao Tummala
  10. Best paper of the Session“, Integral passives, Low-cost embedded capacitor technology with hydrothermal and sol-gel processes 9th International Symposium on Advanced packaging Materials: Processing, Properties and Interfaces, 2004; Devarajan Balaraman, M. Raj, Isaac Robin Abothu and Rao Tummala
  11. Distinguished Scholar Award, 1998 – Awarded by the Microbeam Analysis Society, USA; Edge sharpening for unbiased edge detection in FESEM images. Presented at the symposium on applied image processing, Annual Microscopy and Microanalysis Meeting, Atlanta, July, 1998

 

Student-Paper Awards

  1. First Place – Best Student Paper, First International workshop on Future Car Electronics, 8-9, 2016, Atlanta, Atom Watanabe, P. M. Raj, Rao Tummala, Denny Wong, Ravi Mullapudi, Sven Lamprecht, Robin Taylor, Title: Highly-effective Integrated EMI Shields
  2. Best Student Paper award at the 49th International Symposium on Microelectronics, 2016 held October 10th-13th in Pasadena, United States, “Electrodeposited copper-graphite composites for low-CTE integrated thermal structures”, Shreya Dwarakanath, P M Raj, Vanessa Smet, Venky Sundaram, Rao Tummala
  3. Motorola CPMT Fellowship Award, Tapobrata Bandyopadhyay, Gaurav Mehrotra, Mahadevan K. Iyer, P. M. Raj, Madhavan Swaminathan and Rao R. Tummala, “Microwave Design & Characterization of a Novel Nano-Cu Based Ultra-fine Pitch Chip-to-Package Interconnect”, 58th Electronic Components and Technology Conference, Orlando, May 2008
  4. ‘Best Interactive Presentation Paper’ at IEEE ECTC 2015 – San Diego, Ninad Shahane,M. Raj Modeling, Design and Demonstration of Low-Temperature, Low-Pressure and High-Throughput Thermocompression Bonding of Copper Interconnections without Solders
  5. Best Student Paper (Third Place): Ninad Shahane, M. Raj Low-temperature copper interconnections without solders, at 2015 IEEE Global Interposer Technology Workshop
  6. Third Place – Best Student Paper, First International workshop on Future Car Electronics, 8-9, 2016, Atlanta, Title: Integrated Magnetic Substrates for High-frequency DC-DC Converter in (H)EV Applications. Haksun Lee, Vanessa Smet, P.M. Raj and Rao Tummala
  7. Best Student Paper (Third place): Tantalum based high density capacitor with low leakage for high frequency and low power applications Partha Chakraborti, M. Raj, 2015 Global Interposer Technology Workshop, Atlanta, Nov
  8. Intel Best Student Paper Award”, New paradigms for IC-package reworkable nanointerconnects, Electronic Components and Technology Conference – ECTC 2004 (Student: Ankur Aggarwal, Co-authors: Rao Tummala and M. Raj)
  9. “Best Student Paper (First Place), Dibyajat Mishra, M. Raj and Rao Tummala, Multilayered ferromagnetic-polymer composite structures and their integration into high-density power supply inductors, Third Annual Global Interposer Technology workshop, Nov. 20, 2014
  10. Best Student Paper (Third place), Ting-Chia Huang, Vanessa Smet, Satomi Kawamoto, M. Raj, Rao Tummala, Metastable Cu-Sn interconnections for high-throughput ultra-fine pitch SLID bonding, Third Annual Global Interposer Technology workshop, Nov. 20, 2014
  11. Best Student Paper (Third place), Ninad Shahane, Scott McCann, Vanessa Smet, M. Raj, Rao Tummala, Low-temperature low-pressure Cu interconnections without solders at fine pitch, Third Annual Global Interposer Technology workshop, Nov. 20, 2014
  12. “Best Student Paper (Third place)”, Parthasarathi Chakraborti, Himani Sharma, M. Raj, Rao Tummala, Third Annual Global Interposer Technology workshop, Nov. 20, 2013
  13. IEEE CPMT ECTC Travel Award, Dibyajat Mishra, Electronic Components and Technology Conference, Highly-loaded metal nanoparticles in insulators for high-frequency magnetic films, Dibyajat Mishra, K P Murali, M. Raj, Himani Sharma and Rao Tummala
  14. IEEE CPMT ECTC 2011 Travel Award, Kanika SethiIEEE Electronic Components and Technology Conference, Sharma, K. Sethi, P. M. Raj, Venky Sundaram, and Rao Tummala, “Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers
  15. Second Prize at the “Regional Science Fair”, Arulita Gupta (High School Intern), Nitesh Kumbhat, M. Raj, Rao Tummala, “Compliant Silicon/Glass Interposer to PWB Interconnection”
  16. SECOND PLACE – Second International Workshop on Future Car Electronics (FCE), November 8-10 2017, Georgia Learning Center, Atlanta, Shreya Dwarakanath, Raj Pulugurtha, Etizaz-Shah Hassan, Vanessa Smet, Venky Sundaram, Mark Losego and Rao Tummala, “High-Temperature reliability of high-density power packages for electric vehicles”
  17. SECOND PLACE – Second International Workshop on Future Car Electronics (FCE), November 8-10 2017, Georgia Learning Center, Muhammad Ali, Raj Pulugurtha, Venky Sundaram and Rao Tummala, “High-performance mm-wave passive components for V2X and V2V connectivity”

Published Books and Parts of Books

  1. M. Raj, Parthasarathi Chakraborti, Srikrishna Sitaraman, Saumya Gandhi, John Prymak, Swapan Bhattacharya; “Passives and integration with actives to form power and RF modules”, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R; McGraw Hill Publications, August 2017
  2. Srikrishna Sitaraman, Manos Tentzeris, John Papapolymerou and M. Raj, “Fundamentals of RF and 5G packaging”, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, August 2017
  3. Himani Sharma, P M Raj, Shreya Dwarakanath, “Micro and nanopackaging materials”, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, August 2017
  4. Chandra Nair, Venky Sundaram and P M Raj, “Fundamentals of Packaging substrate materials, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, August 2017
  5. M. Raj, D. W. Lee, L. Li, S. X. Wang, P. Chakraborti, H. Sharma, S. Jain, and R. Tummala, “Embedded Passives,” Materials for Advanced Packaging, pp. 537-588: Editors: Daniel Lu and C P Wong; Springer International Publishing, 2017
  6. M. Raj, Teng Sun, Gopal C. Jha, Swapan K. Bhattacharya and Rao R. Tummala. “Nanogranular magnetic core inductors: Design, fabrication and packaging”, NANOPACKAGING: Nanotechnologies & Electronics Packaging, J E Morris, Ed. Wiley: 2nd edition
  7. M. Raj, Parthasarathi Chakraborti, Dibyajat Mishra, Himani Sharma, Saumya Gandhi, Srikrishna Sitaraman and Rao Tummala, “Nanostructured passive components for power and RF applications,” Nanopackaging – from nanomaterials to the atomic scale, Edited by Xavier Baillin and Poupon Gilles; Springer
  8. M. Raj, Dibyajat Mishra, Erik Shipton, Himani Sharma and Rao Tummala; “Nanomagnetic Structures, Properties and Applications In integrated RF and Power Modules and Sub-systems,” Nanomagnetism, Edited by: Julian Gonzalez; One Central Press, UK; Appeared online in 2014, pp. 1-28
  9. Sharma, H., Chakraborthi, Raj, P. M., Wang, Y., Tummala, R., “Nanocapacitors”, Nanoelectronic Device Applications Handbook, Editors: Morris, J. E., and Iniewski, K.,), CRC Press (Taylor & Francis Group), 2012
  10. Raj, P. M., Wong, C. P., Zhang, Z., and Tummala, R., “Wafer Level Packaging and Assembly”, Chapter 11, System-On-Package, Editors: Tummala, R.R and Swaminathan, McGraw Hill Publications, 2008
  11. Venky Sundaram, Ganesh Krishnan, Raj, P. M., Kohl, P., and Fukuoka, Y., “Digital System-On-Package”, Chapter 8 in “System-On-package”, Editors: Tummala, R.R and Swaminathan, McGraw Hill Publications, 2008
  12. Raj, P. M., Liu, J., and Ohlckers, P., “Packaging Materials, Properties and Processes”, Fundamentals of Electronic Packaging Materials, Processes and Properties, Chapter 18, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, April 2001
  13. Raj, P. M. and Cannon, W. R., “Electrosteric stabilization mechanisms in non-aqueous high solids loading suspensions”, Polymers in Particulate Systems, Editors: Hackley, V. A., Somasundaram, P., and Lewis, J. A., Chapter 2, Marcel-Dekker Publications, April, 2001
  14. Raj, P. M. and Cannon, W. R., “2-D Sintering of Oriented Ellipses by Grain Boundary and Surface Diffusion – A Numerical Study of the Shrinkage Anisotropy” Sintering Science and Technology, Editors: R. German, G. Messing and Robert G. Cornwall, Pennsylvania State University Press, pp. 393-398, 1999

 

SERVICES:

Associate Editor                   IEEE Nanotechnology Magazine

Associate Editor                   IEEE Transactions on Components, Packaging and Manufacturing Technologies

Co-Chair                               IEEE Nanopackaging Technical Committee

Past-Chair                             IEEE ECTC High-speed wireless and components Committee

Steering Committee            IEEE Electronic Packaging Society IoT (Internet of Things)

STEM Ambassador            2015-

Session Chairs                      Several conferences and workshops