![]() Sk Yeahia Been Sayeed |
· Passive neural recording
· Hermetic flex packaging · Embedded-chip or fan-out packaging
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![]() Carlos Riera Cercado |
· Passive components for power conversion
· Wireless power telemetry · High-density magnetic components · |
![]() Sepehr Soroushiani |
· High-density flex packaging
· Additive manufacturing
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· Multiferroic Power and Data telemetry
· Piezoelectric and magnetostrictive materials · Chiplet-scale 3D Packaging · Integrated Hybrid Power Modules · Thermal Management and Storage · Human Brain and Machine Interface · Simulation and Product Design · Neural Links with Electronics · Self-Powered Sensors for Bionic Applications |
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· Nanostructured multiferroics
· Nanoscale hermetic interfaces · Magnetic field therapy
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Abdal Abdalhameed
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· Thermomechanical modeling and design
· Multiphysics simulations |
![]() Huy Nguyen |
· Photonic sensor packaging
· High-density flex packaging · Low-impedance electrode arrays |
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· Low-impedance electrode arrays |
![]() Akeeb Hassan |
· Reamateable inline connectors |