Recent Publications

  1. P. M. Raj, Himani Sharma, Srikrishna Sitaraman, Dibyajat Mishra and Rao Tummala, “System Scaling with Nanostructured Power and RF Components”, Proceedings of IEEE, 2017, Volume 105, Issue 12, pp 2330-2446, Print ISSN: 0018-9219, Online ISSN: 1558-2256, Digital Object Identifier: 10.1109/JPROC.2017.2748520
  2. Wu, J. Min, V. Smet, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-thin 3D IPAC glass interposers for RF front-end modules,”, J. Electron. Package 139(4), 041001 (Jul 27, 2017), Paper No: EP-16-1151; doi: 10.1115/1.4037221
  3. Gianfagna, H. Yu, M. Swaminathan, P. M. Raj, R. Tummala, G. Antonini, “A Machine-Learning Approach for the Design of NanoMagnetic-Based Antennas,” Journal of Electronic Materials, August 2017, Volume 46, Issue 8, pp 4963–4975
  4. C. Huang, V. Smet, S. Kawamoto, P. M. Raj, R.R. Tummala, “Accelerated solid-liquid interdiffusion bonding (SLID) with thermal stability and power handling,” Journal of Electronic Materials, 2017 Volume 47, Issue 1, pp.368-377
  5. Sun, H. Sharma, P. M. Raj, K. Takemura, F. Yoshihiro, S. Hachiya, R. Tummala, “Substrate embedded thin-film inductors with magnetic cores for Integrated Voltage Regulators,” Journal of IEEE Transactions on Magnetics, 10.1109/TMAG.2017.2710324, Vol. 53, Issue 10, pp. 1-9.

 

Patents Issued

  1. Interconnect structures and methods of making the same, P M Raj, Nitesh Kumbhat, Venky Sundaram and Rao Tummala, US Patent 9,173,282
  2. Second Level Interconnect Structures and Methods of Making the Same, P M Raj, Nitesh Kumbhat, Venky Sundaram, Rao Tummala and Qin Xian, US 8, 970, 036
  3. Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures, United States Patent Application, M. Raj, M. Swaminathan, M. K. Iyer, I R Abothu, J H Hwang, R. Tummala, US 7,977,758 B2
  4. Systems and methods for providing high density capacitor processes, P M Raj, Rao Tummala, Andy Fenner, Anna Malin, J D Goud, US 8084841 B2
  5. Integrating Three-Dimensional High Capacitance Density Structures, M. Raj, Devarajan Balaraman, Farrokh Ayazi, Isaac Robin Abothu, Rao Tummala, Patent number 8,174,017
  6. High aspect ratio metal-polymer composite structures for nanointerconnects, US Patent 7,262, 075, Ankur Aggarwal, M. Raj and Rao Tummala issue 2007 October
  7. Lead-free bonding systems, US 7,5556,189 B2, july 7, 2009, Ankur Aggarwal, Isaac Robin Abothu, M. Raj, Rao Tummala
  8. High aspect ratio metal polymer composite structures for nanointerconnects, Ankur Aggarwal, M. Raj and Rao Tummala, US 7,557,448 B2, July 7, 2009.

Full patent applications

  1. Substrate-Compatible Inductors With Magnetic Layers, P M Raj, Furukawa Yoshihiro, Himani Sharma, Teng Sun, Keiji Takemura, Rao Tummala, Filing Date: November 16, 2017, GTRC7524PCT
  2. Magnetic Devices Utilizing Nanocomposite Films Layered With Adhesives, WO/2013/025878, P M Raj, R Tummala, N. Kumbhat, V. Sundaram, S Uppili, J. Ellul, Filed at the USPTO on 8/16/2012
  3. (WO2011123717) Interconnect structures and methods of making the same, P Markondeya Raj, Nitesh Kumbhat, Venky Sundaram, Rao Tummala
  4. (WO2012047506) Second-level interconnect structures and methods of making the name, M. Raj; (US). Kumbhat, Nitesh; (US). Sundaram, Venky; (US). Tummala, Rao R.; (US). Qin, Xian; (US)
  5. Organic Based Dielectric Materials and Methods for Miniaturized RF Components, and Low Temperature Coefficient of Permittivity Composite Devices Having Tailored Filler Materials”, Baik-Woo Lee, M. Raj, Issac Robin Abothu, Swapan Bhattacharya and Rao Tummala Filed 05/08/06 in the USPTO
  6. Reactively formed integrated ceramic capacitors on organic substrates and fabrication methods, M. Raj, Issac Robin Abothu, Devarajan Balaraman and Rao Tummala, Filed 2/27/2006 in the US patent office (Serial No: 11/363,334)

Published Books and Parts of Books

  1. Muhammad Ali, M. Raj, Rao Tummala; “Fundamentals of Communications Systems Packaging”, Fundamentals of Electronic Device and Systems Packaging Technologies, Editor: Tummala, R. R; McGraw Hill Publications, December, 2018
  2. Siddharth Ravichandran, M. Raj, Vanessa Smet and Rao Tummala; “Flexible and Wearable Electronics”, Fundamentals of Electronic Device and Systems Packaging Technologies, Editor: Tummala, R. R; McGraw Hill Publications, December, 2018
  3. M. Raj, Parthasarathi Chakraborti, Srikrishna Sitaraman, Saumya Gandhi, John Prymak, Swapan Bhattacharya; “Passives and integration with actives to form power and RF modules”, Fundamentals of Electronic Device and Systems Packaging Technologies, Editor: Tummala, R. R; McGraw Hill Publications, December, 2018
  4. Srikrishna Sitaraman, Manos Tentzeris, John Papapolymerou and M. Raj, “Fundamentals of RF and 5G packaging”, Fundamentals of Electronic Device and Systems Packaging Technologies, Editor: Tummala, R. R; McGraw Hill Publications, December, 2018
  5. Himani Sharma, P M Raj, Shreya Dwarakanath, “Micro and nanopackaging materials”, Fundamentals of Electronic Device and Systems Packaging Technologies, Editor: Tummala, R. R; McGraw Hill Publications, December, 2018
  6. Chandra Nair, Venky Sundaram and P M Raj, “Fundamentals of Packaging substrate materials, Fundamentals of Microelectronic Systems Packaging, Fundamentals of Electronic Device and Systems Packaging Technologies, Editor: Tummala, R. R; McGraw Hill Publications, December, 2018
  7. M. Raj, D. W. Lee, L. Li, S. X. Wang, P. Chakraborti, H. Sharma, S. Jain, and R. Tummala, “Embedded Passives,” Materials for Advanced Packaging, pp. 537-588: Editors: Daniel Lu and C P Wong; Springer International Publishing, 2017
  8. M. Raj, Teng Sun, Gopal C. Jha, Swapan K. Bhattacharya and Rao R. Tummala. “Nanogranular magnetic core inductors: Design, fabrication and packaging”, NANOPACKAGING: Nanotechnologies & Electronics Packaging, J E Morris, Ed. Wiley: 2nd edition
  9. M. Raj, Parthasarathi Chakraborti, Dibyajat Mishra, Himani Sharma, Saumya Gandhi, Srikrishna Sitaraman and Rao Tummala, “Nanostructured passive components for power and RF applications,” Nanopackaging – from nanomaterials to the atomic scale, Edited by Xavier Baillin and Poupon Gilles; Springer
  10. M. Raj, Dibyajat Mishra, Erik Shipton, Himani Sharma and Rao Tummala; “Nanomagnetic Structures, Properties and Applications In integrated RF and Power Modules and Sub-systems,” Nanomagnetism, Edited by: Julian Gonzalez; One Central Press, UK; Appeared online in 2014, pp. 1-28
  11. Sharma, H., Chakraborthi, Raj, P. M., Wang, Y., Tummala, R., “Nanocapacitors”, Nanoelectronic Device Applications Handbook, Editors: Morris, J. E., and Iniewski, K.,), CRC Press (Taylor & Francis Group), 2012
  12. Raj, P. M., Wong, C. P., Zhang, Z., and Tummala, R., “Wafer Level Packaging and Assembly”, Chapter 11, System-On-Package, Editors: Tummala, R.R and Swaminathan, McGraw Hill Publications, 2008
  13. Venky Sundaram, Ganesh Krishnan, Raj, P. M., Kohl, P., and Fukuoka, Y., “Digital System-On-Package”, Chapter 8 in “System-On-package”, Editors: Tummala, R.R and Swaminathan, McGraw Hill Publications, 2008
  14. Raj, P. M., Liu, J., and Ohlckers, P., “Packaging Materials, Properties and Processes”, Fundamentals of Electronic Packaging Materials, Processes and Properties, Chapter 18, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, April 2001
  15. Raj, P. M. and Cannon, W. R., “Electrosteric stabilization mechanisms in non-aqueous high solids loading suspensions”, Polymers in Particulate Systems, Editors: Hackley, V. A., Somasundaram, P., and Lewis, J. A., Chapter 2, Marcel-Dekker Publications, April, 2001
  16. Raj, P. M. and Cannon, W. R., “2-D Sintering of Oriented Ellipses by Grain Boundary and Surface Diffusion – A Numerical Study of the Shrinkage Anisotropy” Sintering Science and Technology, Editors: R. German, G. Messing and Robert G. Cornwall, Pennsylvania State University Press, pp. 393-398, 1999

 

Published Journal Papers (refereed)

  1. C. Huang, V. Smet, S. Kawamoto, P. M. Raj, R.R. Tummala, “Accelerated solid-liquid interdiffusion bonding (SLID) with thermal stability and power handling,” Journal of Electronic Materials, January 2018, Volume 47, Issue 1, pp 368–377
  2. Demir, A. El Amrani, K. Ramachandran, V. Sukumaran, Y. Sato, V. Sundaram, P. M. Raj, R. Tummala, “Reliability of Fine-Pitch Through-Vias in Glass Interposers and Packages for High-Bandwidth Computing and Communications,” Journal of Materials Science: Materials in Electronics, August 2018, Volume 29, Issue 15, pp 12669–12680
  3. S. Kim, P. M. Raj, Y. Kim, G. Park, K. Cho. V. Smet, V. Sundaram, J. Kim, R. Tummala, “Miniaturized and High-Performance RF Packages with Ultra-thin Glass Substrates”, Microelectronics Journal, Volume 77, July 2018, Pages 66-72.
  4. S. Kim, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-thin High-Q RF 3D Inductors on Glass,” IEEE Components Packaging and Manufacturing Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 8, Issue: 4, April 2018.
  5. Wu, J. Min, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-miniaturized 3D IPD diplexers for LTE applications on 200 μm thick glass substrates”, J. International Microelectronics and Packaging Society (IMAPS), Accepted, June 2018.
  6. Atom O. Watanabe, Pulugurtha Markondeya Raj, Denny Wong, Ravi Mullapudi, Rao Tummala, ” Multilayered Electromagnetic -Interference Shielding Structures for Suppressing Magnetic Field Coupling,” Journal of Electronic Materials, September 2018, Volume 47, Issue 9, pp 5243–5250
  7. Grant Spurney, Himani Sharma1, P M Raj, Rao Tummala, Naomi Lollis, Mitch Weaver, Saumya Gandhi, Matt Romig, Holger Brumm, Ultra-High Density, Thin-Film Tantalum Capacitors with Improved Frequency Characteristics for MHz Switching Power Converters, Journal of Electronic Materials, September 2018, Volume 47, Issue 9, pp 5632–5639.
  8. Youngwoo Kim; Jonghyun Cho; Kyungjun Cho; Junyong Park; Subin Kim; Dong-Hyun Kim; Gapyeol Park; Srikrishna Sitaraman; M. Raj; Rao R. Tummala; Joungho Kim, “Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Year: 2017, Volume: 7, Issue: 9, Pages: 1493 – 1505
  9. Youngwoo Kim; Jonghyun Cho; Jonghoon J. Kim; Kyungjun Cho; Subin Kim; Srikrishna Sitaraman; Venky Sundaram; M. Raj; Rao R. Tummala; Joungho Kim, “Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling”, IEEE Transactions on Electromagnetic Compatibility, Year: 2017, Volume: 59, Issue: 3, Pages: 940 – 951
  10. Demir, T. Ogawa, V. Sundaram, P. M. Raj, R. Tummala, “Reliability of Through-Package-Vias from Via-First Processing with Ultra-Thin Glass,” IEEE Devices and Materials Reliability, Accepted Sept 2017 (in press).
  11. Sitaraman, V. Sukumaran, P. M. Raj, Z. Wu, Y. Suzuki, Y. Kim, V. Sundaram, R. R. Tummala, J. Kim, “Miniaturized Band-Pass filters as Ultra-thin 3D IPDs and Embedded Thinfilms in 3D Glass Modules,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Year: 2017, Volume: 7, Issue: 9, Pages: 1410 – 1418.
  12. Wu, J. Min, V. Smet, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-thin 3D IPAC glass interposers for RF front-end modules,”, J. Electron. Package 139(4), 041001 (Jul 27, 2017), Paper No: EP-16-1151; doi: 10.1115/1.4037221
  13. Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Jaesik Lee, Urmi Ray, Venky Sundaram, M. Raj, Vanessa Smet and Rao Tummala, “Board-level Thermal Cycling and Drop Test Reliability of Large, Ultra-thin Glass BGA Packages for Smart Mobile Applications”, IEEE Transaction on Components Packaging and Manufacturing Technology, 2017, Volume 7, Issue 5, pp. 726-733
  14. Demir, A. Armutlulu, V. Sundaram, P. M. Raj, R. Tummala, “Reliability of Copper Through-Package Vias in Bare Glass Interposers,” IEEE Transaction on Components Packaging and Manufacturing Technology, Year: 2017, Volume: 7, Issue: 6, Pages: 829 – 837
  15. Parthasarathi Chakraborti.; Himni Sharma; Markondeya M. Raj; Saumya Gandhi; Rao Tummala;, “Oxide Composition Studies Of Electrochemically Grown Tantalum Oxide On Sintered Tantalum Using XPS Depth-Profiling And Co-Relation With Leakage Properties”, Accepted in Journal of Materials Science, 2017 (In press)
  16. M. Raj, Himani Sharma, Srikrishna Sitaraman, Dibyajat Mishra and Rao Tummala, “System Scaling with Nanostructured Power and RF Components”, Accepted in Proceedings of IEEE, 2017 (in press), Print ISSN: 0018-9219, Online ISSN: 1558-2256, Digital Object Identifier: 10.1109/JPROC.2017.2748520
  17. Shreya Dwarakanath, M. Raj, Kaya Demir, Vanessa Smet, Venky Sundaram, and Rao Tummala (2017), “Electrodeposited Copper-Graphite Composites for Low-CTE-Integrated Thermal Structures”. Journal of Microelectronics and Electronic Packaging: April 2017, Vol. 14, No. 2, pp. 56-62
  18. Gianfagna, H. Yu, M. Swaminathan, P. M. Raj, R. Tummala, G. Antonini, “A Machine-Learning Approach for the Design of NanoMagnetic-Based Antennas,” Journal of Electronic Materials, August 2017, Volume 46, Issue 8, pp 4963–4975
  19. Min, M. Kim, T. Sun, P. M. Raj, R. Tummala, “High-Performance and Miniaturized RF Components with Nanomagnetics”, J Mater Sci: Mater Electron (2017). https://doi.org/10.1007/s10854-017-7396-2
  20. Sun, H. Sharma, P. M. Raj, K. Takemura, F. Yoshihiro, S. Hachiya, R. Tummala, “Substrate embedded thin-film inductors with magnetic cores for Integrated Voltage Regulators,” Journal of IEEE Transactions on Magnetics, 10.1109/TMAG.2017.2710324, Appeared online: June 2017
  21. Parthasarathi Chakraborti, Himani Sharma, P M Raj, Rao Tummala, “XPS Depth Profiling and Leakage Properties of Anodized Titania Dielectrics and their Application in High Density Capacitors”, Journal of Materials Science, December 2015, Volume 50, Issue 23, pp 7600–7609
  22. Chakraborti, H. Sharma, P. M. Raj, K.-P. Rataj, C. Schnitter, N. Neuhart, S. Jain, S. Gandhi, R. Tummala, “Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors with Low-Leakage Currents and High-Operating Frequencies,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol., pp. 1-9, 2016
  23. Kim, J. Cho, J. J. Kim, K. Kim, K. Cho, S. Kim, S. Sitaraman, P M Raj, V. Sundaram, R. Tummala and J Kim, “Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel,” IEEE Transactions on Electromagnetic Compatibility, vol. 58, pp. 1747-1759, 2016
  24. Lee, B. S. Cook, K. P. Murali, P. M. Raj and M. M. Tentzeris, “Inkjet printed high-Q RF inductors on paper substrate with ferromagnetic nanomaterial”, IEEE Microwave and Wireless Components Letters, Vol. 26, (6), June, pp. 419-421, 2016
  25. Gandhi, M. P. M. Raj, H. Sharma, P. Chakraborti, R. R. Tummala, “High-k Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, issue 10, pp. 1561-1566, 2016
  26. Han, M. Swaminathan, P. M. Raj, H. Sharma, R. Tummala, S. Yang, et al., “Magneto-Dielectric Nanocomposite for Antenna Miniaturization and SAR Reduction,” IEEE Antennas and Wireless Propagation Letters, Vol. 15, pp. 72-75, 2016
  27. Mishra, P. M. Raj, J. Tishler, T. Sun, E. Shipton, R. Tummala, “Multilayered Ferromagnetic Polymer Composite Structures for High-Density Power Inductors”, IEEE Transactions on Magnetics, vol. 52, pp. 1-5, 2016
  28. Mishra, P. M. Raj, R. Tummala, “Design, fabrication and characterization of thin power inductors with multilayered ferromagnetic-polymer composite structures,” Microelectronic Engineering, Vol. 160, pp. 34-38, 2016
  29. Gandhi, S. Xiang, M. Kumar, H. Sharma, P. Chakraborti, P. M. Raj, R. Tummala, “Dielectric–electrode interactions in glass and silicon-compatible thin-film (Ba, Sr) TiO3 capacitors,” Journal of Materials Science: Materials in Electronics, pp. 1-6, Sept 2016
  30. P. Murali, H. Sharma, P. M. Raj, D. Mishra, M. Goyal, K. Silver, E. Shipton, R. Tummala, “Structure-magnetic property correlations in nickel-polymer nanocomposites,” Journal of Materials Science: Materials in Electronics, Vol. 27, pp. 154-162, 2016
  31. P. Murali, P. M. Raj, H. Sharma, R. Tummala, “CoY hexaferrite-PEEK composites for integrated and miniaturized RF components,” Journal of Materials Science: Materials in Electronics, Vol. 27, pp. 7010-7017, 2016
  32. Sharma, P. M. Raj, R. Tummala, “Chemical synthesis of low-coercivity, silica/Co composites for high-frequency magnetic components,” Materials Chemistry and Physics, Vol. 175, pp. 46-53, 2016
  33. Kyuhwan Han, Madhavan Swaminathan, M. Raj, Himani Sharma, Rao Tummala, Brandon Rawlings, Vijay Nair. “RF Characterization of Magneto-dielectric Material using Cavity Perturbation Technique”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 5, Issue: 12, Dec. 2015, pp. 1850 – 1859
  34. Qin Xian, P M Raj, Vanessa Smet and Rao Tummala. “Direct SMT Interconnections of Large Silicon, Glass and Low CTE Organic Interposers to Printed Wiring Board using Copper Microwire Arrays”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 5, Issue: 11, Nov. 2015, pp. 1709-1719
  35. Himani Sharma, Shubham Jain, P M Raj, KP Murali,, Rao Tummala, “Magnetic and Dielectric Property Studies in Fe- and NiFe-based Polymer Nanocomposites” Journal of Electronic Materials, 2015, Vol. 44, pp. 3819-3826
  36. Kyu Han, Madhavan Swaminathan, M. Raj, Himani Sharma, Rao Tummala, Songnan Yang and Vijay Nair, “Magneto-Dielectric Nanocomposite for Antenna Miniaturization and SAR Reduction”, Antennas and Wireless Propagation Letters, IEEE, Volume: 15, ISSN 1536-1225, DOI: 10.1109/LAWP.2015.2430284, pp. 72-75
  37. M. Raj, Dibyajat Mishra, Srikrishna Sitarman, Rao Tummala “Nanomagnetic Thinfilms for Advanced Inductors and EMI Shields in Smart Systems”, Journal of Materials Nanoscience, J. Mat. NanoSci. 2014, 1(1), 31-38
  38. M. Raj, Himani Sharma, G. Prashant Reddy, Nevin Altunyurt, Madhavan Swaminathan, Rao Tummala, And Vijay Nair, Cobalt–Polymer Nanocomposite Dielectrics For Miniaturized Antennas, Journal Of Electronic Materials, Doi: 10.1007/S11664-014-3025-5, April 2014, Volume 43, Issue 4, pp 1097-1106
  39. Koushik Ramachandran, Jud Ready, M. Raj, Venky Sundaram, Rao Tummala, Insulation Reliability of Fine-pitch Through-vias in Halogen-free Epoxy Substrates, Journal of Materials Science D: Materials in Electronics; 15:1687-1695 (2014)
  40. Xian Qin, Nitesh Kumbhat, M. Raj, Venky Sundaram and Rao Tummala, Finite Element Analysis and Experimental Validation of Reliability of Silicon and Glass Interposers-to-Printed Wiring Board SMT interconnections, IEEE Components, Packaging and Manufacturing Technologies, In press, ISSN: 2156-3950, Digital Object Identified: 10.1109/TCPMT.2013.2296780, May 2014, pp. 696-806
  41. Sadia A. Khan, Abhishek Choudhury, Nitesh Kumbhat, M. Raj, Venky Sundaram, Georg Meyer-Berg*, and Rao Tummala, Multi-Chip Embedding Technology Using Fine Pitch Cu-Cu Interconnections, Transactions on Components, Packaging and Manufacturing Technology. Issue 2, Feb. 2013, pp. 197-204
  42. Wang, Y., Xiang, S., Raj, P. M., Sharma, H., Williams, B., and Tummala, R. R., “All-Solution Thin-film Capacitors and their Deposition in Trench and Through-Via Structures”, IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT), 3, Issue 4, 2013, pp. 688-695
  43. Ramachandran, K., Lui, F., Raj, P. M., Sundaram, V., Tummala, R., “Conductive anodic filament failures in fine-pitch through-via interconnections in organic package substrates”, Journal of Electronic Materials, February 2013, Volume 42, Issue 2, pp 348-354
  44. Raj, P. M., Reddy, G. P., Nataraj, N., Jha, G., Kumbhat, N., Brese, N., and Tummala, R., “Co-electrodeposited Solder Composite Films for Advanced Thermal Interface Materials”, Transactions of Components, Packaging and Manufacturing Technology, Issue 3, Vol. 6., June 2013, pp. 989-996
  45. M. Raj, Himani Sharma, Saurabh Samtani, Dibyajat Mishra, Vijay Nair and Rao Tummala, “Magnetic losses in metal nanoparticle-insulator nanocomposites”, Journal of Materials Science D, Materials in Electronics, DOI: 10.1007/s 10854-013-1269-0, PRINT ISSN: 0957-4522, Online ISSN:1573-482X, September 2013, Volume 24, Issue 9, pp 3448-3455
  46. Kumbhat, N., Choudhury, A. , Mehrotra, G., Raj, P. M., Sundaram, V. , “Highly Reliable and Manufacturable Ultrafine Pitch Cu-Cu Interconnections for Chip-Last Embedding With Chip-First Benefits”, IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT), 2, NO. 9, Sept 2012
  47. Sharma, H., Sethi, K., Raj, P.M., Tummala, R., ” Fabrication and characterization of novel silicon-compatible high-density capacitors ” Journal of Materials Science: Materials in Electronics, Vol. 28, No. 2, pp. 528-535, 2012
  48. Raj, P.M., Xiang, S., Kumar, M., Abothu, I.R., Hwang, J.H., Liu, Y., Yamamoto, H., Tummala, R., ” Leakage current suppression in solution-deposited barium titanate films on copper foils ” Journal of Materials Science: Materials in Electronics, Vol. 23, No. 4, pp. 901-908, 2012
  49. Sharma, H., Sethi, K., Raj, P.M., Gerhardt, RA, Tummala, R., ” Mechanistic interaction study of thin oxide dielectric with conducting organic electrode ” Materials Chemistry and Physics, Vol. 134, No. 1, pp. 508-513, 2012
  50. Raj, P.M., Lee, B.W., Balaraman, D., Tummala, R.R., ” Leakage current analysis of hydrothermal BaTiO 3 thin films ” Journal of Electroceramics, Vol. 27, No. 3-4, pp. 169-175, 2011
  51. Raj, P.M., Lee, B.W., Kang, N.K., Tummala, R.R., Lance, M.J., Meyer III, H.M., ” Hydrothermal Thin Film Characteristics and their Suitability for Power Supply Applications ” Journal of the American Ceramic Society, Vol. 93, No. 9, pp. , 2010
  52. Cannon, W.R., Raj, P.M., ” Evolution of Sintering Anisotropy Using a 2D Finite Difference Method “, Journal of the American Ceramic Society, Vol. 92, No. 7, pp. 1391-1395, 2009
  53. Hwang, J.H., Markondeya Raj, P., Abothu, I.R., Yoon, C., Iyer, M., Jung, H.M., Hong, J.K., Tummala, R., ” Temperature dependence of the dielectric properties of polymer composite based RF capacitors ” Microelectronic Engineering, Vol. 85, No. 3, pp. 553-558, 2008
  54. Aggarwal, A.; Markondeya Raj, P.; Baik-Woo Lee; Myung Jin Yim; A.; Iyer, M.; Wong, C.P.; Tummala, R., Thermomechanical Reliability of Nickel Pillar Interconnections Replacing FlipChip Solder without Underfill”, IEEE Transactions on Electronics Packaging Manufacturing, October, vol. 31, No. 4, pp. 341-354, 2008
  55. Raj, P.M., Balaraman, D., Abothu, I.R., Yoon, C., Kang, N.K., Tummala, R., ” Integrating high-k ceramic thin film capacitors into organic substrates via low-cost solution processing ” Components and Packaging Technologies, IEEE Transactions on, Vol. 30, No. 4, pp. 585-594, 2007
  56. Raj, P.M., Balaraman, D., Govind, V., Abothu, I.R., Wan, L., Gerhardt, R., Swaminathan, M., Tummala, R., ” Processing and dielectric properties of nanocomposite thin film “Supercapacitors” for high-frequency embedded decoupling ” Components and Packaging Technologies, IEEE Transactions on, Vol. 30, No. 4, pp. 569-578, 2007
  57. Aggarwal, A.O., Raj, P.M., Tummala, R.R., ” Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging ” Advanced Packaging, IEEE Transactions on, Vol. 30, No. 3, pp. 384-392, 2007
  58. Aggarwal, A.O., Abothu, I.R., Raj, P.M., Sacks, M.D., Tummala, R.R., ” Lead-Free Solder Films Via Novel Solution Synthesis Routes ” Components and Packaging Technologies, IEEE Transactions on, Vol. 30, No. 3, pp. 486-493, 2007
  59. Kumbhat, N., Raj, P.M., Pucha, R.V., Tsai, J.Y., Atmur, S., Bongio, E., Sitaraman, S.K., Tummala, R.R., ” Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging ” Advanced Packaging, IEEE Transactions on, Vol. 30, No. 4, pp. 641-653, 2007
  60. Bhattacharya, S.K., Raj, P.M., Balaraman, D., Windlass, H., Tummala, R.R., ” Process development for PWB compatible embedded capacitors ” Circuit World, Vol. 30, No. 1, pp. 31-35, 2004 . Raj is the project leader and key author for the paper
  61. Lee, B.W., Abothu, I.R., Raj, P.M., Yoon, C.K., Tummala, R.R., ” Tailoring of temperature coefficient of capacitance (TCC) in nanocomposite capacitors ” Scripta materialia, 54, No. 7, pp. 1231-1234, 2006
  62. Banerji, S., Raj, P.M., Bhattacharya, S., Tummala, R.R., ” Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needs ” Advanced Packaging, IEEE Transactions on, Vol. 28, No. 1, pp. 102-113, 2005
  63. Tummala, R., Aggarwal, A., Bansal, S., Raj, PM, ” SMT Goes From Micro to Nanoscale ” SMTA News And Journal Of Surface Mount Technology, Vol. 18, No. 3, pp. 19, 2005
  64. Tummala, R.R., Swaminathan, M., Tentzeris, M.M., Laskar, J., Chang, G.K., Sitaraman, S., Keezer, D., Guidotti, D., Huang, Z., Lim, K., Raj, P. M., ” The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade ” Advanced Packaging, IEEE Transactions on, Vol. 27, No. 2, pp. 250-267, 2004, Cambridge Univ Press
  65. Kumbhat, N., Raj, P. M., Hegde, S., Pucha, R. V., Sundaram, V., Hayes, S., Atmur, S., Bhattacharya, S., Sitaraman, S. K., and Tummala, R. R., “Novel Board Material Technology for Next-Generation Microelectronic Packaging” in “Developments in Dielectric Materials and Electronic Devices”, Ceramic Transactions (K.M.Nair et al, Editors), Vol.167, pp. 371-382, 2004
  66. Pucha, R.V., Sitaraman, S.K., Hegde, S., Damani, M., Wong, C. P., Qu, J., Zhang, Z., Raj, P.M., and Tummala, R., “Materials and mechanics challenges in SOP-based convergent systems”, Invited paper, Micromaterials and nanomaterials, Issue No. 3, pp. 110-123, Aug, 2004
  67. Balaraman, D., Raj, PM, Wan, L., Abothu, IR, Bhattacharya, S., Dalmia, S., Lance, MJ, Swaminathan, M., Sacks, MD, Tummala, RR, ” BaTiO 3 films by low-temperature hydrothermal techniques for next generation packaging applications ” Journal of electroceramics, Vol. 13, No. 1, pp. 95-100, 2004
  68. Tummala, R.R., Raj, P.M., Atmur, S., Bansal, S., Banerji, S., Liu, F., Bhattacharya, S., Sundaram, V., Shinotani, K., White, G., ” Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging ” Journal of electroceramics, Vol. 13, No. 1, pp. 417-422, 2004
  69. Shinotani, K.I., Raj, P.M., Seo, M., Bansal, S., Sakurai, H., Bhattacharya, S.K., Tummala, R., “Evaluation of alternative materials for system-on-package (SOP) substrates ” Components and Packaging Technologies, IEEE Transactions on, Vol. 27, No. 4, pp. 694-701, 2004
  70. Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., ” Colloidal processing of polymer ceramic nanocomposite integral capacitors ” Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 26, No. 2, pp. 100-105, 2003
  71. Windlass, H., Markondeya Raj, P., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., ” Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications ” Advanced Packaging, IEEE Transactions on, 26, No. 1, pp. , 2003
  72. Raj, P.M., Odulena, A., Cannon, WR, ” Anisotropic shrinkage during sintering of particle-oriented systems–numerical simulation and experimental studies ” Acta materialia, Vol. 50, No. 10, pp. 2559-2570, 2002
  73. Raj, P.M., Cannon, W.R., ” Anisotropic Shrinkage in Tape‐Cast Alumina: Role of Processing Parameters and Particle Shape ” Journal of the American Ceramic Society, Vol. 82, No. 10, pp. 2619-2625, 1999
  74. Raj, P.M., Cannon, W.R., ” 2-D particle shape averaging and comparison using Fourier descriptors ” Powder technology, Vol. 104, No. 2, pp. 180-189, 1999
  75. Raj, P.M., Dunn, S.M., Cannon, W.R., ” Edge Sharpening for Unbiased Edge Detection in Field Emission Scanning Electron Microscope Images ” Microscopy and Microanalysis, Vol. 5, No. 2, pp. 136-146, 1999
  76. Raj, P.M., Dunn, S.M., Cannon, W.R., ” Measurement of particle orientation in tape cast ceramic microstructures ” Journal of computer-assisted microscopy, Vol. 10, No. 1, pp. 33-51, 1998
  77. Raj, PM, Dunn, SM, Cannon, WR, ” Edge sharpening for unbiased edge detection in field emission scanning electron microscope (FESEM) Images ” Microscopy And Microanalysis, Vol. 4, No. , pp. 62-63, 1998
  78. Cosandey, F., Raj, P. M., Cannon, W., ” Texure Determination Of Ceramic Materials By EBSD ” Microscopy And Microanalysis-NEW YORK-, Vol. 5, pp. 224-225, 1999
  79. Raj, P.M., and Jacob, K. T., “Standard molar Gibbs free energies of formation of CoMoO2 and Co3MoO4: Consistency Requirements.”, Materials Transactions, Japan Institute of Metals, Vol. 36, No. 5, pp. 693 – 694 (1995)
  1. Raj, P.M., ” A critical assessment of the standard molar Gibbs free energy of formation of NiWO 4 ” Bulletin of Materials Science, Vol. 18, No. 5, pp. 623-630, 1995
  2. Raj, P.M., and Jacob, K. T., “Standard molar Gibbs free energies of formation of CoMoO2 and Co3MoO4: Consistency Requirements.”, Materials Transactions, Japan Institute of Metals, Vol. 36, No. 5, pp. 693 – 694 (1995)
  1. Raj, P.M., ” A critical assessment of the standard molar Gibbs free energy of formation of NiWO 4 ” Bulletin of Materials Science, Vol. 18, No. 5, pp. 623-630, 1995

Submitted Journal Papers

  1. Muhammad Ali, P M Raj, Fuhan Liu, Venky Sundaram and Rao Tummala, First Demonstration of Compact, Ultra-thin Lowpass and Bandpass Filters for 5G Small-Cell Applications, IEEE Microwave and Wireless Components Letters
  2. Kaya Demir, Brandon D. Piercy, Mark Losego, Venky Sundaram, M. Raj, and Rao Tummala, “Analysis of Through-Package-Via Stresses in Glass using Raman spectroscopy”, Journal of International Micrelectronics and Packaging Society

Conference Paper

  1. Ninad Shahane, P M Raj, Chandrasekharan Nair, Vanessa Smet, Chintan Buch and Rao Tummala, Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics, IEEE Nanotechnology Magazine, To appear in Dec 2018
  2. Rao R. Tummala, Venky Sundaram, M. Raj, Vanessa Smet, “Future of Embedding and Fan-out Technologies”, Chip Scale Review, February 2017
  3. M. Raj, Saumya Gandhi, Srikrishna Sitaraman, Venky Sundaram, Rao Tummala, “3DIPAC, A New Concept in integrated passive and active components”, Chip Scale Review, Sept-Oct 2013
  4. M. Raj, Xian Qin, Jialing Tong, Gary Menezes, Vanessa Smet and Rao Tummala, “Large Silicon, Glass or Low-CTE Organic Package to Printed Wiring Board SMT Interconnections”, Chip Scale Review, Sept-Oct 2013
  5. Raj, P.M., Sharma, H., Mishra, D., Murali, KP, Han, K., Swaminathan, M., Tummala, RR, “Nanomagnetics for High-Performance, Miniaturized Power, and RF Components Nanopackaging] ” Nanotechnology Magazine, IEEE, Vol. 6, No. 3, pp. 18-23, 2012
  6. Swaminathan, M., Sundaram, V., Papapolymerou, J., Markondeya Raj, P., ” Polymers for RF Apps-Advanced polymers for RF packaging applications ” IEEE Microwave Magazine, Vol. 12, No. 7, pp. 62, 2011. Raj is the key author for one of the sections in the paper
  7. Tummala, R.R., Sundaram, V., Raj, PM, Pucha, R., Bandyopadhyay, T., Kumbhat, N., Sridharan, V., Walden-Monroe, T., Sutter, D., ” Georgia Tech’s Vision for Ultra-miniaturized Device and Systems Packaging ” Chip Scale Review, Vol. 14, No. 4, pp. 14-18, 2010
  8. Tummala, R., Wong, CP, Markondeya Raj, P., ” Nanopackaging research at Georgia Tech ” Nanotechnology Magazine, IEEE, Vol. 3, No. 4, pp. 20-25, 2009
  9. Kumbhat, N., Raj, P.M., Pucha, R.V., Sundaram, V., Bongio, E., Sitaraman, S., Tummala, R.R., ” Packaging Substrates-A Novel Low CTE, High Stiffness Ceramic Composite Core-A new substrate meets attributes for solder joint reliability, dielectric reliability, low warpage and microvia ” Circuits Assembly, Vol. 18, No. 1, pp. 28-29, 2007
  10. Tummala, R., Raj, PM, “SoP for Multifunctional System Packages: Through Thin Film Component Integration in Contrast to SiP with Stacked IC Modules ” Advanced Packaging, Vol. 14, No. 7, pp. 18, 2005
  11. Raj, P. M., Balaraman, D., Abothu, I. R., and Tummala, R. R., “Achieving ceramic properties for embedding components in organic substrates”, Advanced Packaging, March 2006, pp. 20
  1. Tummala, R., Raj, PM, Sundaram, V., ” Next-generation Packaging Materials New Developments in Board/Package Materials and Processes ” Advanced Packaging, Vol. 13, No. , pp. 26-33, 2004
  2. Tummala, R., RAJ, P.M., Sundaram, V., ” Next-Generation Packaging Material ” Advanced Packaging, Vol. 13, No. 6, pp. , 2004

Conference Publications

  • Design and demonstration of ultra-thin 3D glass-based 5G modules with low-loss interconnects, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), DOI: 10.23919/ICEP.2018.8374698, Apr 17-21, 2018.
  • Tong-Hong Lin, Ryan A. Bahr, and Manos M. Tentzeris, P. Markondeya Raj, Venky Sundaram, and Rao Tummala, “Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and Modules for Broadband 5G Applications”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Shreya Dwarakanath, P. Markondeya Raj, Vanessa Smet, Venky Sundaram, Mark Losego, Rao Tummala, “High-Temperature and Moisture Ageing Reliability of High-Density Power Packages for Electric Vehicles”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29  – June 1, 2018.
  • Kashyap Mohan, Ninad Shahane, Ramon Sosa, P. M. Raj, Vanessa Smet, Rao Tummala and Sadia Khan, “Demonstration of Patternable, Compliant Cu Pillar with Nanocopper Cap Interconnections for Manufacturable Cu-Cu Bonding in Chip-to-Substrate Applications”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Nithin Nedumthakady, Bartlet Deprospo, P. Markondeya Raj, Venky Sundaram, Rao Tummala, Kyle Byers, Sean Garrison, Chris Gibson, Michael Elsbury, “Integrated Cu Heat Spreaders in Glass Fan-Out (GFO) Packages Using Near-Zero Resistance Thermal Interface Material (TIM) for High-Power Devices”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Atom O. Watanabe, Tong-Hong Lin, P. Markondeya Raj, Venky Sundaram, Manos M. Tentzeris, and Rao R. Tummala, Tomonori Ogawa, “Leading-Edge and Ultra-Thin 3D GlassPolymer 5G Modules With Seamless Antenna-to-Transceiver Signal Transmissions”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Muhammad Ali, Atom O. Watanabe, Fuhan Liu, Markondeya R. Pulugurtha, Venkatesh Sundaram, Manos M. Tentzeris and Rao. R. Tummala, “Miniaturized High-Performance Filters for 5G Small-Cell Applications”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Robert Grant Spurney, Himani Sharma, P.M. Raj, Rao Tummala, Naomi Lollis, Mitch Weaver, Saumya Gandhi, Matt Romig, “High-Temperature Embedded Aluminum Capacitors on Silicon for Miniaturized High-Voltage Power Modules”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Martin Letz, Wu Zihan, Sukhadha Viswanathan, Matthias Jotz, Holger Maune, Matthias Jost, P. Markondeya Raj, Venkatesh Sundaram and Rao Tummala, “Glass in electronic packaging and integration: High Q inductances for 2.35 GHz impedance matching in 0.05 mm thin, glass substrates”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, May 29 – June 1, 2018.
  • Wenjing Su, Zihan Wu, Yunnan Fang, Ryan Bahr, Pulugurtha Markondeya Raj, Rao Tummala, and Manos M. Tentzeris, “3D Printed Wearable Flexible SIW and Microfluidics Sensors for Internet of Things and Smart Health Applications”, International Microwave Symposium, 2017, 4-9 June 2017, Honolulu, Hawaii
  • Tong-Hong Lin, M. Raj, Atom Watanabe, Venky Sundaram, Rao Tummala, and Manos M. Tentzeris, “Nanostructured Miniaturized Artificial Magnetic Conductors (AMC) for High-Performance Antennas in 5G, IoT, and Smart Skin Applications”, IEEE Nanotechnology Conference, 2017, Pittsburg, July 25-28
  • Mohan, N. Shahane, P. M. Raj, A. Antoniou, V. Smet, R. Tummala, ” Low-temperature, organics-free sintering of nanocopper foams for reliable, high-temperature and high-power die-attach interconnections” 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), Tampa, FL, 2017, 26-30 March 2017, 10.1109/APEC.2017.7931137
  • Dwarakanath, P. M. Raj, K. Demir, V. Smet, V. Sundaram, R. Tummala, “Electrodeposited copper-graphite composites for low-CTE integrated thermal structures,” in International Symposium on Microelectronics: FALL 2016, Vol. 2016, No. 1, pp. 88-93 *Best Paper Award*
  • Rao R. Tummala, Venky Sundaram, M. Raj, Vanessa Smet, “Future of Embedding and Fan-out Technologies”, Pan Pacific Microelectronics Symposium, February 6-9, 2017
  • Dwarakanath, P. M. Raj, C. Leng, M.D. Losego, R. R. Tummala, “Organic-inorganic hybrid dielectrics with improved high-temperature reliability,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Jayaram, S. McCann, B. Singh, P. M. Raj, H. Matsuura, Y. Takagi, T. Huang, V. Smet, R. Tummala,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Lee, V. Smet, P. M. Raj, R. Tummala, “Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Shahane, K. Mohan, G. Ramos, A. Kilian, R. Taylor, F. Wei, P. M. Raj, An. Antoniou, V. Smet, R. Tummala, “Enabling chip-to-package Cu-Cu interconnections: design of engineered bonding interfaces for improved manufacturability and low-temperature bonding,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Smet, P. M. Raj, R. Taylor, G. Ramos, R. Nichols, A. Kilian, R. Tummala, “Scaling Cu pillars to 20um pitch and below: strategic role of surface finish and barrier layers” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • G. Spurney, H. Sharma, M.P. M. Raj, N. Lollis, M. Romig, S. Gandhi, H. Brumm, R. Tummala, “High Voltage and High Temperature Capacitors for Next-Generation Power Modules in Electric Vehicles,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Sundaram, B. DeProspo, P. M. Raj, N. Gezgin, R. Tummala, K. Byers, S. Garrison, G. Kraus, M. Elsbury, “Integrated Copper Heat Slugs and EMI shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF IC’s,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Viswanathan, T. Huang, T. Ogawa, P. M. Raj, F. Liu, V. Sundaram, R. Tummala, “High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine Pitch, Copper Metallized Through Package Vias (TPVs) in Ultra-Thin Glass Substrates,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • Watanabe, M. Ali, B. Tehrani, J. Hester, H. Matsuura, T. Ogawa, M. P. M. Raj, V. Sundaram, M. M. Tentzeris, R. R. Tummala, “First Demonstration of 28GHz and 39GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 – June 2, 2017, accepted Nov 2016
  • T. Khan; S. Sitaraman; A. L. Vera; M. P. M. Raj; V. Sundaram; R. R. Tummala; J. Papapolymerou, A V-band end-fire Yagi-Uda antenna on an ultra-thin glass packaging technology, 2015 European Microwave Conference (EuMC), Year: 2015, Pages: 618 – 621
  • Carmine Gianfagna, Madhavan Swaminathan, P M Raj, Rao Tummala, Giulio Antonini, Enabling Antenna Design with Nano-Magnetic Materials using Machine Learning, IEEE Nanotechnology Materials and Devices (NMDC), 86-90, 2015
  • Erik Shipton, Harley Hayden and Greg Mohler, M. Raj, Teng Sun, Srikrishna Sitaraman, and Rao Tummala, Nanomagnetic Films and Arrays for Nonlinear Devices in Highly-Integrated RF Modules, IEEE-NANO 2015, Rome, July 26-29, 2015
  • Lee, M.M. Tentzeris, P. M. Raj, K P Murali and Y.Kawahara, “Inkjet-Printed Ferromagnetic Nanoparticles for Miniaturization of Flexible Printed RF Inductors”, Procs. 2013 IEEE International Symposium on Antennas and Propagation, pp.994-994, Orlando, FL, July 2013
  • Buch, M. Raj, B. Brown, H. Sharma, T. Sun, K.-S. Moon, K-J Wolter, R. Tummala “Ultra-Thin Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2364-2371
  • Chakraborti, N. Neuhart, K. P. Rataj, C. Schnitter, S. Gandhi, H. Sharma, P. M. Raj, F. Stepniak, M. Romig, N. Lollis, R. R. Tummala, “Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1958-1963
  • Demir, A. Benali, V. Sundaram, P. M. Raj, R. Tummala, “Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 799-805
  • C. Huang, V. Smet, P. M. Raj, R. R. Tummala, G. Ramos, A. Kilian, R. Taylor, R. Nichols, “Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-Fine Pitch Applications,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2553-2560
  • Jayaram, S. McCann, T. C. Huang, S. Kawamoto, P. M. Raj, V. Smet, R. Tummala, “Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 101-107
  • S. Kim, M. P. M. Raj, Z. Wu, V. Sundaram, R. Tummala, “Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2384-2388
  • McCann, S. Kuramochi, H. Yun, V. Sundaram, M. P. M. Raj, R. R. Tummala, S. K. Sitaraman, “Board-Level Reliability of 3D through Glass via Filters during Thermal Cycling,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1575-1582
  • Min, Z. Wu, M. M. Raj, V. Smet, V. Sundaram, A. Ravindran, C. Hoffmann, R. Tummala, “Modeling Design Fabrication and Demonstration of RF Front-End Module with Ultra-Thin Glass Substrate for LTE Applications,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1297-1302
  • Shahane, K. Mohan, R. Behera, A. Antoniou, P. R. Markondeya, V. Smet, et al., “Novel High-Temperature, High-Power Handling All-Cu Interconnections through Low-Temperature Sintering of Nanocopper Foams,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 829-836
  • Singh, T.-C. Huang, S. Kawamoto, V. Sundaram, P. M. Raj, V. Smet, R. Tummala, “Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1377-1385
  • Sun, P. M. Raj, J. Min, Z. Wu, H. Sharma, T. Takahashi, K. Takemura, H. Yun, F. Carobolante, R. Tummala, “Magnetic Materials and Design Trade-Offs for High Inductance Density, High-Q and Low-Cost Power and EMI Filter Inductors,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 374-379
  • Tummala, K. J. Wolter, V. Sundaram, V. Smet, P. M. Raj, “New era in automotive electronics, a co-development by Georgia tech and its automotive partners,” in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), January 25, 2016 – January 28, 2016, Big Island, HI, United States, 2016, pp.1-4
  • O. Watanabe, S. Jeong, S. Kim, Y. Kim, J. Min, D. Wong, R. Mullapudi, P. M. Raj, Ra. Tummala, Y. Kim, J. Kim, “Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 206-210
  • Wu, J. Min, M. Kim, M. P. M. Raj, V. Sundaram, R. R. Tummala, “Design and Demonstration of Ultra-Thin Glass 3D IPD Diplexers,” in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 – June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2348-2352
  • Min Suk Kim, Sangbeom Cho ; Junki Min ; Pulugurtha, M.R. , Huang, N. ; Sitaraman, S. ; Sundaram, V. ; Velez, M. ; Ravindran, A. ; Joshi, Y. ; Tummala, R., “Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation”, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 1163-1167
  • Sitaraman, S., Junki Min, P M Raj, Venky Sundaram, Rao Tummala, (2015). “Modeling, Design and Demonstration of Trench-based Electromagnetic Shielding in Miniaturized RF Glass Packages”. Electronic Components and Technology Conference (ECTC), 2015, IEEE 65th, pp. 1956-1960
  • Saumya Gandhi, M. Raj, Bruce C. Chou, Parthasarathi Chakraborti, Min Suk Kim, Srikrishna Sitaraman, Himani Sharma, Venky Sundaram and Rao Tummala, Ultra-thin and Ultra-small 3D Double-side Glass Power Modules with Advanced Inductors and Capacitors, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 230-235
  • M. Raj, Chandrasekharan Nair, Hao Lu, Fuhan Liu, Venky Sundaram, Dennis W. Hess+, Rao Tummala , “Zero-Undercut” Semi-Additive Copper Patterning – A Breakthrough for Ultrafine-line RDL Lithographic Structures and Precision RF Thinfilm Passives, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 402-405
  • Vanessa Smet, Ting-Chia Huang, Satomi Kawamoto, Bhupender Singh, Venky Sundaram, Pulugurtha Markondeya Raj and Rao Tummala, Interconnection Materials, Processes and Tools for Fine-pitch Panel Assembly of Ultra-thin Glass Substrates, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 475-483
  • Kaya Demir, Saumya Gandhi, Tomonori Ogawa, Raghu Pucha, Vanessa Smet, Venky Sundaram, M. Raj and Rao Tummala, First Demonstration of Copper-plated Through-Package-Via (TPV) Reliability in Ultra-thin 3D Glass Interposers with Double-side Component Assembly, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 666-671
  • Dibyajat Mishra, Srikrishna Sitaraman, Saumya Gandhi, Sun Teng, M.Raj, Himani Sharma and Rao Tummala, T. N. Arunagiri, Z. Dordi and R. Mullapudi, Nanomagnetic Structures for Inductive Coupling and Shielding in Wireless Charging Applications, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 941-945
  • Ting-Chia Huang, Vanessa Smet, Satomi Kawamoto, Venky Sundaram, M. Raj, and Rao R. Tummala, Modeling, Design and Demonstration of Ultra-short and Ultra-fine Pitch Metastable Cu-Sn Interconnections with High-throughput SLID Assembly, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 1377-1384
  • Bhupender Singh, Vanessa Smet, Jaesik Lee, Gary Menezes, Makoto Kobayashi, Pulugurtha Markondeya Raj, Venky Sundaram, Brian Roggeman, Urmi Ray, Riko Radojcic, and Rao Tummala, First Demonstration of Drop-test Reliability of Ultra-thin Glass BGA Packages Directly Assembled on Boards for Smartphone Applications, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, 1566-1573
  • Ninad Shahane, Scott McCann, Gustavo Ramos, Arnd Killian, Robin Taylor, Venky Sundaram, Pulugurtha Markondeya Raj, Vanessa Smet, and Rao Tummala, Modeling, Design and Demonstration of Low-temperature, Low-pressure and High-throughput Thermocompression Bonding of Copper Interconnections without Solders, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, 1859-1865
  • Kyu Han, Madhavan Swaminathan, M. Raj, Himani Sharma, Rao Tummala, Brandon Rawlings, Songnan Yang and Vijay Nair, Synthesis of Magneto-Dielectrics from First Principles and Antenna Design, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 2228-2234
  • Parthasarathi Chakraborti, Saumya Gandhi, Himani Sharma, M. Raj, Kamil-Paul Rataj2 and Rao Tummala, Demonstration of Ultra-thin Tantalum Capacitors on Silicon Substrates for High-frequency and High-efficiency Power Applications, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 2254-2258
  • M. Raj, Himani Sharma, KyuHwan Han, Saumya Gandhi, Srikrishna Sitaraman, Madhavan Swaminathan and Rao Tummala, Tunable and Miniaturized RF Components with Nanocomposite and Nanolayered Dielectrics, IEEE-NANO 2014, Ontario, Aug 18-21, 2014, pp. 27-31
  • Magneto-dielectric material characterization and Antenna Design for RF applications, Kyu Han, Madhavan Swaminathan, M. Raj, Himani Sharma, Rao Tummala and Vijay Nair, 8th European Conference on Antennas and Propagation, The Hague, Netherlands, April 6-11, 2014
  • M. Raj, Chandrasekharan Nair, Hao Lu, Fuhan Liu, Venky Sundaram, Dennis W. Hess, Rao Tummala, Zero-Undercut” Semi-Additive Copper Patterning – A Breakthrough for Ultrafine-line RDL Lithographic Structures and Precision RF Thinfilm Passives, Electronic Components and Technology Conference (ECTC), IEEE 64th, San Diego, May 26-28, 2015
  • Vanessa Smet, Makoto Kobayashi, Tao Wang, Pulugurtha Markondeya Raj, and Rao Tummala, A New Era in Manufacturable, Low-Temperature and Ultra-Fine Pitch Cu Interconnections and Assembly Without Solders; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 484-489 
  • Tao Wang, Vanessa Smet, Makoto Kobayashi+, Venky Sundaram, P Markondeya Raj, and Rao Tummala, Modeling, Design, and Demonstration of Low-temperature Cu Interconnections to Ultra-thin Glass Interposers at 20 µm Pitch; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 284-289 
  • Gary Menezes, Vanessa Smet, Makoto Kobayashi+, Venky Sundaram, Pulugurtha Markondeya Raj, and Rao Tummala, Large low-CTE Glass package-to-PCB interconnections with solder strain-relief using polymer collars; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 1959-1964 
  • Chinmay Honrao, Ting-Chia Huang, Makoto Kobayashi#, Vanessa Smet, M. Raj, and Rao Tummala, Accelerated Solid Liquid InterDiffusion(SLID) bonding using thin multi-layer copper-solder stack for fine-pitch interconnections; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 1160-1165 
  • Timothy Huang, Akira Mieno, Venky Sundaram, M. Raj, Himani Sharma, and Rao Tummala, Adhesion and Reliability of Direct Cu Metallization of Through-Package Vias in Glass Interposer; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 2266-2270 
  • Gokul Kumar, M. Raj, Jounghyun Cho, Saumya Gandhi, Parthasarathi Chakraborti, Venky Sundaram, Joungho Kim and Rao Tummala, Coaxial Through-Package-Vias (TPVs) for Enhancing Power Integrity in 3D Double-side Glass Interposers; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 541-547 
  • Saumya Gandhi, Liyi Li, Ho-Yee Hui, Parthasarathi Chakraborti, Himani Sharma, M. Raj, C.P. Wong and Rao Tummala, Nanowires-based high-density capacitors and thinfilm power sources in ultrathin 3D glass modules; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 1492-1497 
  • Srikrishna Sitaraman, Yuya Suzuki, Christopher White, Vijay Nair, Telesphor Kamgaing, Frank Juskey, Sung Jin Kim, M. Raj, Venky Sundaram, and Rao Tummala, Modeling, Design and Demonstration of Multi-Die Embedded WLAN RF Front-End Module with Ultra-miniaturized and High-performance Passives; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 1264-1271 
  • Sung Jin Kim, Zihan Wu, Makoto Kobayashi, Fuhan Liu, Vanessa Smet, M. Raj, Venky Sundaram, and Rao Tummala, Design and Demonstration of Paper-Thin and Low-Warpage Single and 3D Organic Packages with Chip-Last Embedding Technology for Smart Mobile Applications; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 1384-1388 
  • Kyu Han, Madhavan Swaminathan, M. Raj, Himani Sharma, Rao Tummala and Vijay Nair, Magneto-dielectric Characterization and Antenna Design; Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 782-788 
  • Chinmay Honrao, Akira Mieno, Makoto Kobayashi, Vanessa Smet, M. Raj, Venky Sundaram, Sung Jin Kim, Rao Tummala, “Leading-Edge Fine-Pitch Off-Chip Interconnection Processes for Simultaneous Underfilling and Reflowing, Conference: SRC Techcon 2013, Austin TX; Date: 9-10 September 2013
  • Xian QinGottschall, S. ; Kumbhat, N. Raj, P.M. ;Sungjin Kim ; Sundaram, V. ; Tummala, R. ; Large silicon, glass and low CTE organic interposers to printed wiring board SMT interconnections using copper microwire arrays  Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 1109/ECTC.2013.6575675 ; Publication Year: 2013, Page(s): 867 – 871
  • Gandhi, S.Raj, P.M. ; Sundaram, V. ; Sharma, H. ;Swaminathan, M. ; Tummala, R. ; Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd ; A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module; Digital Object Identifier: 1109/ECTC.2013.6575727 ; Publication Year: 2013, Page(s): 1197 – 1203
  • Sung Jin KimHonrao, C. ; Raj, P.M. ; Sundaram, V. ;Tummala, R.; Ultra-thin and ultra-high I/O density package-on-package (3D Thin PoP) for high bandwidth of smart systems; Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 1109/ECTC.2013.6575603 ; Publication Year: 2013, Page(s): 406 – 411
  • Chakraborti, P.Sharma, H. ; Raj, P.M. ; Tummala, R.; Ultra-thin, self-healing decoupling capacitors on thin glass interposers using high surface area electrodes ; Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 1109/ECTC.2013.6575701 ; Publication Year: 2013, Page(s): 1043 – 1047
  • Raj, P.M.Uei-Ming Jow ; Jinxiang Dai ; Murali, K.P. ;Sharma, H. ; Mishra, D. ; Xiao, T.D. ; Gandhi, S. ;Ghovanloo, M. ; Tummala, R.; 3D IPAC — A new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules; Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 1109/ECTC.2013.6575621, pp. 517-522. 
  • Sundaram, V.Qiao Chen ; Tao Wang ; Hao Lu ; Suzuki, Y. ;Smet, V. ; Kobayashi, M. Pulugurtha, R. ; Tummala, R.; Low cost, high performance, and high reliability 2.5D silicon interposer; Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 1109/ECTC.2013.6575593; Publication Year: 2013, Page(s): 342 – 347
  • Makondeya Raj, K. P. Murali, Saumya Gandhi and Rao Tummala, Kirk Slenes and Nathan Berg, “Integration of Precision Resistors and Capacitors with Near-Zero Temperature Coefficients in Silicon and Organic Packages” Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 910-914, 2012.
  • Chakraborti, P., Sharma, H., Raj, P.M., Tummala, R., ” High-density capacitors with conformal high-k dielectrics on etched-metal foils ” Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 1640-1643, 2012
  • Gandhi, S., Xiang, S., Raj, P.M., Sundaram, V., Swaminathan, M., Tummala, R., ” A low-cost approach to high-k thinfilm decoupling capacitors on silicon and glass interposers ” Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 1356-1360, 2012
  • Han, K., Swaminathan, M., Raj, P.M., Sharma, H., Murali, KP, Tummala, R., Nair, V., ” Extraction of electrical properties of nanomagnetic materials through meander-shaped inductor and inverted-F antenna structures ” Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 1808-1813, 2012
  • Khan, S.A., Kumbhat, N., Goyal, A., Okoshi, K., Raj, P.M., Meyer-Berg, G., Sundaram, V., Tummala, R., ” High current-carrying and highly-reliable 30μm diameter Cu-Cu area-array interconnections without solder ” Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 577-582, 2012
  • Raj, P.M., Sharma, H.,Tummala, R.R., “Silicon and glass-integrated thinfilm power components”, Proceedings of the CARTS International 2012, Capacitor and resistor Technology Symposium, Las Vegas, pp. 287-296, 2012
  • Mishra, D., Raj, P.M., Khan, S., Kumbhat, N., Wang, Y., Addya, S., Pucha, R.V., Choudhury, A., Sundaram, V., Tummala, R., ” Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections ” Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 916-920, 2011
  • Sethi, K., Sharma, H., Raj, P.M., Sundaram, V., Tummala, R., ” Conformal Atomic Layer Deposition (ALD) of alumina on high surface-area porous copper electrodes to achieve ultra-high capacitance density on silicon interposers ” Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 1928-1932, 2011
  • Wang, Y., Xiang, S., Raj, PM, Sharma, H., Williams, B., Tummala, R., ” Solution-derived electrodes and dielectrics for low-cost and high-capacitance trench and Through-Silicon-Via (TSV) capacitors ” Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1987-1991, 2011.
  • Choudhury, A., Kumbhat, N., Khan, S.A., Raj, P.M., Sundaram, V., Meyer-Berg, G., Tummala, R., ” High throughput and fine pitch Cu-Cu interconnection technology for multichip chip-last embedding ” Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 2021-2027, 2011
  • Raj, P.M., Sharma, H., Reddy, G.P., Altunyurt, N., Swaminathan, M., Tummala, R., Nair, V., Reid, D., ” Novel nanomagnetic materials for high-frequency RF applications ” Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1244-1249, 2011
  • Raj, P.M., Sharma, H., Sethi, K., Wang, Y., Sundaram, V., Tummala, R., ” Thin film power components with nanoscale electrodes and conformal dielectrics ” Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on, 106-110, 2011
  • Choudhury, A., Kumbhat, N., Raj, P.M., Zhang, R., Sundaram, V., Dunne, R., Bolanos-Avila, M., Wong, CP, Tummala, R., ” Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology ” Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, 350-356, 2010
  • Reddy, G.P., Raj, P.M., Nataraj, N., Rajesh, PM, Jha, G., Choudhury, A., Kumbhat, N., Tummala, R., Brese, N., Toben, M., ” Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials ” Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, 1708-1712, 2010
  • Kumbhat, N., Choudhury, A., Raine, M., Mehrotra, G., Raj, P.M., Zhang, R., Moon, K.S., Chatterjee, R., Sundaram, V., Meyer-Berg, G., ” Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF ” Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1479-1485, 2009
  • Altunyurt, N., Swaminathan, M., Raj, P. M., Nair, V., “Analysis on the miniaturization of reactive impedance surfaces with magneto-dielectrics”, Antennas and Propagation Society International Symposium, APSURSI ’09. IEEE,1-5 June, Page(s):1 – 2009
  • Tummala, R.R., Chatterjee, R., Raj, P.M., and Sundaram, V., Aschenbrenner, R., and Reichl, H., Kim, J., “System-On-Wafer by 3D All Silicon Systems Technology”, Proceedings of SMTA Conference, Feb. 10-12, 2009
  • Tummala, R.R., Sundaram, V., Chatterjee, R., Raj, P.M., Kumbhat, N., Sukumaran, V., Sridharan, V., Choudury, A., Chen, Q., Bandyopadhyay, T., ” Trend from ICs to 3D ICs to 3D systems ” Custom Integrated Circuits Conference, CICC’09. IEEE, 439-444, 2009.
  • Altunyurt, N., Swaminathan, M., Raj, P.M., Nair, V., ” Antenna miniaturization using magneto-dielectric substrates ” Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 801-808, 2009
  • Liu, J., Goud, J., Raj, P.M., Iyer, M., Wang, Z.L., Tummala, RR, ” Real-time protein detection using ZnO nanowire/thin film bio-sensor integrated with microfluidic system ” Electronic Components and Technology Conference, ECTC 2008. 58th, 1317-1322, 2008
  • Raj, P.M., Jha, G., Mehrotra, G., Goud, J., Iyer, M., and Tummala, R.R., “ A novel nano SMT approach for WLSOP”, pp. 205-210, Pan Pacific Microelectronics symposium and Table top exhibition, Jan 22-24 2008, Hawaii
  • Mehrotra, G., Jha, G., Goud, J.D., Raj, P.M., Venkatesan, M., Iyer, M., Hess, D., Tummala, R., ” Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer ” Electronic Components and Technology Conference, ECTC 2008. 58th, 1410-1416, 2008
  • Raj, P.M., Hwang, J.H., Jung, H.M., Kumar, M., Jha, G., Coulter, K., Wellinghoff, S., Iyer, M., Tummala, R., ” Low Temperature (≪ 100° C) deposited pyrochlore films with high capacitance (200 nF/cm2), low loss (∼003) and low TCF (≪ 100 ppm/C) for integrating RF components ” Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 688-693, 2008
  • Bandyopadhyay, T., Mehrotra, G., Iyer, M.K., Raj, P.M., Swaminathan, M., Tummala, R.R., ” Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect ” Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 1242-1248, 2008
  • Goud, J.D., Raj, P.M., Liu, J., Narayan, R., Iyer, M., Tummala, R., ” Electrochemical Biosensors and Microfluidics in Organic System-on-Package Technology ” Electronic Components and Technology Conference, 2007. ECTC’07. Proceedings. 57th, 1550-1555, 2007
  • Liu, J., Goud, J., Raj, PM, Iyer, M., Wang, Z., Tummala, RR, ” Label-Free Protein Detection by ZnO Nanowire Based Bio-Sensors ” Electronic Components and Technology Conference, 2007. ECTC’07. 57th, pp. 1971-1976, 2007
  • Hwang, J.H., Raj, P.M., Abothu, I.R., Yoon, C., Iyer, M., Jung, H.M., Hong, J.K., Tummala, R., ” Organic-based RF capacitors with ceramic-like properties ” Electronic Components and Technology Conference, 2007. ECTC’07. Proceedings. 57th, 1866-1869, 2007
  • Abothu, I.R., Raj, P.M., Hwang, J.H., Kumar, M., Iyer, M., Yamamoto, H., Tummala, R., ” Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages ” Electronic Components and Technology Conference, 2007. ECTC’07. Proceedings. 57th, 1014-1018, 2007
  • Tummala, R.R., Raj, P.M., Agrawal, A., Moon, J.K., Wong, C.P., Goud, J., Bandyopadhyay, T., and Iyer, M., “NanoPackaging”, Proceedings of the Pan Pacific Symposium, Jan, 2007
  • Raj, P.M., Coulter, K., Hwang, J.H., Wellinghoff, S., Iyer, M., and Tummala, R.R., “Low Temperature Processes to Integrate High k-Low Loss Thin Films In Organic Substrates for RF Capacitors”, IMAPS Advanced Technology Workshop on Embedded Passives, Nov. 16-18, San Jose, CA, 2007
  • Raj, P.M., Sundaram, V., Goud, J.D., Swaminathan, M., and Iyer, M., and Tummala, R.R, “SOP for Miniauturized Multifunctional Wearable Electronics”, IMAPS Advanced Technology Workshop on Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications, May 7-10, Baltimore, MD, 2007
  • 8 Tummala, R.R., Swaminathan, M., Iyer, M., Raj, P.M., Sundaram, ,Emerging Device and Systems Packaging Trends”, Third International Conference and Exhibition on Device Packaging, International Microelectronics And Packaging Society (IMAPS), Scottsdale, Arizona USA, March 19-22, 2007
  • Tummala, R.R., Raj, P.M., Agrawal, A., Moon, J.C., Wong, C.P., Goud, J., Bandyopadhyay, T., and Iyer, M., “Nanopackaging”, Proceedings of SMTA Conference, Hawaii, Feb, 2007
  • Goud, J.D., Raj, P.M., Iyer, M., and Tummala, R.R., “ Micro-electrochemical Enzyme Inhibition Biosensor with MWCNTs, Zirconia / Nafion Enzyme Encapsulation for Environmental, Pesticide Monitoring.” Electrochemical Society Workshop, Nov 16, 2007, Atlanta, GA
  • Aggarwal, A., Markondeya Raj, P., Lee, B.W., Yim, M.J., Tambawala, A., Iyer, M., Swaminathan, M., Wong, CP, Tummala, R., ” Reliability of nano-structured nickel interconnections replacing flipchip solder assembly without underfill ” Electronic Components and Technology Conference, 2007. ECTC’07. Proceedings. 57th, 905-913, 2007
  • Muthana, P., Engin, E., Raj, PM, Swaminathan, M., Tummala, R., Sundaram, V., Amey, D., Dietz, K., Banerji, S., ” Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications ” 7th Annual Austin CAS Conference, , 2006
  • Raj, PM, Abothu, IR, Abdolvand, R., Ayazi, F., Tummala, R., ” Integrating Solution-Derived 3D PZT Structures on Si Mems Platform for RF and Biomedical Applications ” Advanced Packaging Materials: Processes, Properties and Interface, 11th International Symposium on, 122-122, 2006
  • Goud, JD, Raj, P.M., Iyer, M., Tummala, R., ” Biofunctionalization of Multi-walled Carbon Nanotubes (MWNTs) for the Fabrication of Protein Nano Biosensors ” Advanced Packaging Materials: Processes, Properties and Interface, 11th International Symposium on, 119-121, 2007
  • Kumar, M., Xiang, , Raj, P. M., Abothu, I. R., Hwang, J.-Hyun, Yamamoto, H.,* and Tummala, R., “Electrical Reliability of Solgel Barium Titanate Films on Copper Foils for Organic Package Integration”, MRS Spring Meeting – 2010, Symposium C – Solution Processing of Inorganic and Hybrid Materials for Electronics and Photonics
  • Goud, J., Raj, P.M., Liu, J., Iyer, M., Wang, ZL, Tummala, R., “Conductimetric Detection of Protein and Cancer Cells with Oxide Nanosensors ” MRS Proceedings, Vol. 1010, No. 1, 2007
  • Tummala, R., Wong, CP, Qu, J., Sitaraman, S., Markondeya Raj, P., ” Fututre of Packaging and packaging materials ” Advanced Packaging Materials: Processes, Properties and Interface, 11th International Symposium on, 57-57, 2006
  • Abothu, I.R., Lee, B.W., Markondeya Raj, P., Engin, E., Muthana, P., Yoon, C.K., Swaminathan, M., Tummala, R.R., ” Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications ” Electronic Components and Technology Conference, Proceedings. 56th, 5, 2006
  • Sundaram, V., Tummala, R., Wiedenman, B., Liu, F., Markondeya Raj, P., Abothu, IR, Bhattacharya, S., Varadarajan, M., Bongio, E., Sherwood, W., ” Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration ” Electronic Components and Technology Conference, Proceedings. 56th, 6., 2006
  • Tummala, R.R., Markondeya Raj, P., Aggarwal, A., Mehrotra, G., Koh, S.W., Bansal, S., Tiong, T.T., Ong, CK, Chew, J., Vaidyanathan, K., ” Copper interconnections for high performance and fine pitch flip chip digital applications and ultra-miniaturized RF module applications ” Electronic Components and Technology Conference, 2006. Proceedings. 56th, 10 pp., 2006
  • Tummala, R.R., Raj, P.M., Goud, J.D., and Iyer, M., “Nano SOP for Ultra-miniaturized Electronic and Bio-electronic Systems”, Proceedings of SMTA Conference, pp. 191-200, Hawaii, Jan. 17, 2006
  • Xiao, TD, Raj, PM, Wan, L., Zhang, H., Ma, X., Reisner, DE, Zhang, YD, Balaraman, D., Bhattacharya, S., Abothu, IR, ” Magnetic Nanocomposite Paste: An Ideal High-, K and Q Nanomaterial for Miniaturized Antennas and Inductors ” , In session 5, Soft Nanotechnology and Self Assembly, 2005 NSTI Nanotechnology and tradeshow, Nanotech
  • Muthana, P., Swaminathan, M., Engin, E., Raj, P.M., Tummala, R.R., “Mid-Frequency Decoupling using Embedded Decoupling Capacitors.” Electrical Performance of Electronic Packaging, Oct 24-26, Page(s)271-274, 2005
  • Muthana, P., Swaminathan, M., Tummala, R., Raj, P.M., Engin, E., Wan, L., Balaraman, D., Bhattacharya, S., ” Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems ” Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on, Vol. 2, No. , pp. 638-643, 2005
  • Wan, L., Raj, P.M., Balaraman, D., Muthana, P., Bhattacharya, S.K., Varadarajan, M., Abothu, I.R., Swaminathan, M., Tummala, R., ” Embedded decoupling capacitor performance in high speed circuits ” Electronic Components and Technology Conference, 2005. 55th, pp. 1617-1622, 2005
  • Muthana, P., Swaminathan, P., Tummala, R., Sundaram, V., Wan, L., Bhattacharya, SK, Raj, P.M., ” Packaging of Multi-Core Microprocessors: Tradeoffs and Potential Solutions ” Electronic Components and Technology Conference, 2005. Proceedings. 55th, 1895-1903, 2005
  • Aggarwal, A.O., Raj, P.M., Sundaram, V., Ravi, D., Koh, S., Tummala, RR, Mullapudi, R., ” 50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects ” Electronc Components and Technology Conference, 55, No. 2, pp. 1139, 2005
  • Kumbhat, N., Raj, P.M., Pucha, R.V., Atmur, S., Doraiswamy, R., Sundaram, V., Bhattacharya, S., Sitaraman, S.K., Tummala, R.R., ” Recent Advances in Composite Substrate Materials for High-Density and High Reliability Packaging Applications ” Electronic Components and Technology Conference, 1364-1372, 2005
  • Balaraman, D., Raj, PM, Abothu, R., Bhattacharya, S., Sacks, M., Lance, M., Meyer, H., Swaminathan, M., Tumrnala, R., ” Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications ” Electronic Components and Technology Conference, 2005. Proceedings. 55th, 1215-1221 Vol. 2, 2005
  • Lee, KJ, Bhattacharya, S., Varadarajan, M., Wan, L., Abothu, I.R., Sundaram, V., Muthana, P., Balaraman, D., Raj, PM, Swaminathan, M., ” Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates ” Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. International Symposium on, pp. 249-254, 2005
  • Raj, P. M., Balaraman, D., Govind, V., Abothu, I R., Bhattacharya S., Swaminathan M., and Tummala R., “Magnetic nanocomposites for organic compatible miniaturized antennas and inductors”, International Conference on Advanced Packaging Materials: Processing, Properties and Interfaces, March 16-18, pp. 272-275, 2005
  • Xiao, TD, Ma, XQ, Zhang, H., Reisner, DE, Raj, PM, Wan, L., Tummala, R., ” Magnetic Nanocomposite Paste: An Ideal High-µ, k and Q Nanomaterial for Embedded Inductors in High Frequency Electronic Applications ” Proceedings of the 9th World Multiconference on Systemics, Cybernetics and Informatics, , 2005
  • Tummala, R. R., Raj, P. M., Goud, J. D., Iyer, M.,, “Nano- electronic system materials for electronic and bio electronic applications”, International Conference on Advanced Materials Design & Development, ICAMDD, Dec. 14-16, pp. 317-321, 2005
  • Wan, L., Markondeya Raj, P., Swaminathan, M., Tummala, R., ” Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs ” Electronic Packaging Technology, 2005 6th International Conference on, 108-112, 2005
  • Raj, M., Balaraman, D., Govind, V., Abothu, I.R., Bhattacharya, S., Swaminathan, M., and Tummala, R.R., “Are supercapacitive nanocomposite thin films suitable for embedded decoupling?”, International Workshop on Integrated Passives, Marco Island, International Symposium on Microelectronics, International Microelectronics and Packaging Society, January 25-26, 2005
  • Muthana, P., Swaminathan, M., Tummala, R.R., Raj, M., Engin, E., Wan, L., Balaraman, D., Bhattacharya, S., “ Design, Modeling and Characterization of Embedded Capacitor Networks for Mid-frequency Decoupling in Semiconductor Systems”, Proceedings, International Symposium on Microelectronics, International Microelectronics and Packaging Society, Philadelphia, September 16-18, 2005
  • Muthana, P.; Swaminathan, M.; Engin, E. Raj, P.M., Tummala, R.R., “Mid frequency decoupling using embedded decoupling capacitors”, Electrical Performance of Electronic Packaging, 200 IEEE 14th Topical Meeting on, 24-26 Oct., Page(s):271 – 274, 2005.
  • Tummala, R.R., Raj, P.M., Goud, J.D.,and Iyer, M., “Nano- electronic system materials for electronic and bio electronic applications”, International Conference on Advanced Materials Design & Development, ICAMDD, Dec. 14-16, pp. 317-321, – Goa, India, 2005
  • Aggarwal, A.O., Raj, PM, Abothu, I.R., Sacks, M.D., Tayl, AAO, Tummala, R.R., ” New paradigm in IC package interconnections by reworkable nano-interconnects ” Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 1, No., pp. 451-460, 2004
  • Abothu, I.R., Raj, P.M., Balaraman, D., Govind, V., Bhattacharya, S., Sacks, M.D., Swaminathan, M., Lance, M.J., Tummala, R.R., ” Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes ” Electronic Components and Technology Conference, 2004. 54th, pp. 514-520, 2004
  • Balaraman, D., Choi, J., Patel, V., Raj, P.M., Abothu, I.R., Bhattacharya, S., Wan, L., Swaminathan, M., Tummala, R., ” Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors ” Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 1, pp. 282-288 , 2004
  • Aggarwal, A.O., Raj, P.M., Tummala, R.R., ” High aspect ratio metal-polymer composite structures for nano interconnects ” Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. 2004 Proceedings. 9th International Symposium on, 182-186, 2004
  • Aggarwal, A.O., Naeli, K., Raj, P.M., Ayazi, F., Bhattacharya, S., Tummala, R.R., ” MEMS composite structures for tunable capacitors and IC-package nano interconnects ” Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 1, No. , pp. 835-842, 2004
  • Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R., ” Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects ” Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings. 9th International Symposium on, 69-73, 2004
  • Abothu, I.R., Raj, P.M., Balaraman, D., Sacks, M.D., Bhattacharya, S., Tummala, R.R., ” Low-cost embedded capacitor technology with hydrothermal and sol-gel processes ” Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings. 9th International Symposium on, 78-83, 2004
  • Aggarwal, A.O., Markondeya Raj, P., Sacks, M.D., Tay, A.A.O., Tummala, R.R., ” Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects ” Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th, 132-137, 2004
  • Tummala, R.R., Raj, P.M., and Sundaram, V., “Microsystems packaging from microscale to microscale to nanoscale”, High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP ’04. Proceeding of the Sixth IEEE CPMT Conference on 30 June-3 July, Page(s):1 – 7, 2004.
  • Tummala, R.R., Raj, M. and Wang, Z.L., “Nanoscale packaging and nano-bio electronic systems Proceedings”, Annual Symposium of the Electrochemical Society, Hawaii, October 4, 2004
  • Liu, F., Tummala, R.R., Sundaram, V., Guidotti, D., Huang, Z., Chang, Y-Z., Abothu, I.R., Raj, M., Bhattacharya, S., Balaraman, D., Chang, G.K., “Multifunctional Integrated Substrate Technology for High Density SOP Packaging”, Proceedings of the 6th IEEE CPMT conference on High Density Microsystem Design and Packaging, Shanghai, China, pp. 83-90, June, 2004
  • Kumbhat, N., Pucha, R.V., Raj, M., Sundaram, V., Bhattacharya, S., Hayes, S., Atmur, S., Sitaraman, S.K., and Tummala, R.R., “Development and Evaluation of Low-Cost C-SiC Substrates for High-Density Build-up Microvia and Solder-Joint Reliability”, Proceedings, International Symposium on Microelectronics, International Microelectronics and Packaging Society, Long Beach, California, November 16-18, 2004
  • Aggarwal, O.A., Raj, M., Tummala, R.R., “Innovative, Scalable and Reworkable Metal-Polymer Composite Nano Interconnects for Ultra Fine-Pitch Wafer Level Packages”, Proceedings, International Symposium on Microelectronics, International Microelectronics and Packaging Society, Long Beach, California, November 16-18, 2004
  • Sundaram, V., Tummala, R.R., White, G., Lim, K., Wan, L., Guidotti, D., Liu, F., Bhattacharya, , Raj, P.M., Abothu, I.R., Doraiswami, R., Pucha, R.V., Laskar, J., Tentzeris, M., Chang, G.K., and Swaminathan, M., “First single module demonstration of SOP with digital, optical and RF for last mile broadband applications”, International Conference on Electronic Packaging, ICEP, April 14-16, pp. 399-404, Tokyo, Japan, 2004
  • Kumbhat, N., Markondeya Raj, P., Pucha, R.V., Sundaram, V., Doraiswami, R., Bhattacharya, S., Hayes, S., Atmur, S., Sitaraman, S.K., Tummala, R.R., ” Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly ” Electronic Components and Technology Conference, 2004 54th, pp. 1843-1850 , 2004
  • Tummala, R.R., Markondeya Raj, P., Sundaram, V., “Microsystems packaging from milli to microscale to nanoscale ” High Density Microsystem Design and Packaging and Component Failure Analysis, 2004 HDP’04. Proceeding of the Sixth IEEE CPMT Conference on, , 2004
  • Markondeya Raj, P., Balaraman, D., Govind, V., Wan, L., Abothu, R., Gerhardt, R., Bhattacharya, S., Swaminathan, M., Tummala, R., ” High frequency characteristics of nanocomposite thin film supercapacitors and their suitability for embedded decoupling ” Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th, 154-161, 2004
  • Kumbhat, N., Hegde, S., Markondeya Raj, P., Pucha, R.V., Doraiswami, R., Hayes, S., Atmur, S., Bhattacharya, S., Sitaraman, S.K., Tummala, R.R., ” Novel board material technology for next-generation packaging ” Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings. 9th International Symposium on, 247-252, 2004
  • Tummala, R., Raj, P. M., and Wang, Z. L., “Nanoscale packaging and nano-bio electronic systems”, Proceedings, Annual Symposium of the Electrochemical Society, Hawaii, October 4, 2004
  • Bansal, S., Raj, PM, Shinotani, K., Bhattacharya, S., Tummala, R., Lance, MJ, ” In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill” Electronic Components and Technology Conference, 2003. Proceedings. 53rd, 148-155, 2003
  • Balaraman, D., Raj, P.M., Bhattacharya, S., Abothu, I.R., Dalmia, S., Wan, L., Swaminathan, M., and Tummala, R.R., “Synthesis of Ceramic Thin Films for Organic Board Compatible Integral Capacitors – Processing and Characterization”, Proceedings, International Microelectronics and Packaging Society, pp. 200-206, Boston, MA, November, 2003
  • Balaraman, D., Raj, PM, Abothu, IR, Bhattacharya, S., Dalmia, S., Wan, L., Swaininathan, M., Tummala, R., ” Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100° C) ” Electronic Components and Technology Conference, 2003. Proceedings. 53rd, 1520-1527, 2003
  • Aggarwal, AO, Abothu, IR, Raj, PM, Ravi, D., Sacks, MD, Tay, AO, Tummala, RR, ” Sol-gel derived and repairable nano-interconnects ” Electronics Packaging Technology, 2003 5th Conference (EPTC 2003), 385-389, 2003
  • Kumbhat, N., Raj, P.M., Bansal, S., Doraiswami, R., Bhattacharya, S., Tummala, R., Hayes, S., Atmur, S., ” New package/board materials technology for next-generation convergent microsystems ” Electronics Packaging Technology, 2003 5th Conference (EPTC 2003), 331-335, 2003
  • Brownlee, K., Shinotani, K., Raj, PM, Bbattacharya, SK, Wong, CP, Tummala, RR, ” Evaluation of low stress dielectrics for board application ” Electronic Components and Technology Conference, 2003 53rd, pp. 136-141, 2003
  • AGGARWAL, A.O., ABOTHU, I.R., MARKONDEYA RAJ, P., Ravi, D., SACKS, M.D., TUMMALA, R.R., ” Novel low-cost sol-gel derived materials for nano-structured and repairable interconnects ” Proceedings, International Microelectronics and Packaging Society, 943-948, 2003
  • BALARAMAN, D., MARKONDEYA RAJ, P., ABOTHU, I.R., BHATTACHARYA, S., SACKS, M.D., TUMMALA, R., LANCE, M.J., ” Synthesis of ceramic thin films for organic board compatible integral capacitors: Processing and characterization “, Proceedings, International Microelectronics and Packaging Society, Boston, MA, pp. 200-205, 2003
  • Tummala, R.R., Sundaram, V., White, G., Raj, M., Liu, F., Bhattacharya, S.,“ High density packaging for 2010 and beyond ”, pp. 1-10, 4th International Symposium for Electronic Materials and Packaging, Taiwan, 2002
  • Tummala, R.R., Dalmia, S., Balaraman, D., Hobbs, J., Windlass, H., Bavisi, A., Raj, M., Lee, S.H., Bhattacharya, S., White, G., Ayazi, F., Swaminathan, S., Erbil, A., Ogawa, T., “ Recent Advances in Integral Passives Research at Georgia Tech”, International Conference on Electronic Packaging, Tokyo, Japan, April, pp 116-123, 2002
  • Brownlee, K., Raj, P.M., Bhattacharya, S.K., Shinotani, K., Wong, CP, Tummala, R.R., “Evaluation of liquid crystal polymers for high performance SOP application ” Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 676-680, 2002.
  • Aggarwal, AO, Markondeya Raj, P., Pratap, RJ, Saxena, A., Tummala, RR, ” Design and fabrication of high aspect ratio fine pitch interconnects for wafer level packaging ” Electronics Packaging Technology Conference, 2002. 4th, 229-234, 2002
  • Banerji, S., Markondeya Raj, P., Liu, F., Shinotani, K., Bhattacharya, S., Tummala, R.R., “The role of stiff base substrates in warpage reduction for future high-density-wiring requirements ” Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on, 221-225, 2002
  • Balaraman, D., Markondeya Raj, P., Tanikella, R., Kohl, P., Bhattacharya, S., Tummala, R., ” Low temperature (3 films for integral capacitors ” Electronics Packaging Technology Conference, 2002. 4th, 79-84, 2002
  • Balaraman, D., Markondeya Raj, P., Bhattacharya, S., Tummala, R.R., ” Novel hydrothermal processing (< 100° C) of ceramic-polymer composites for integral capacitor applications ” Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 1699-1703, 2002
  • Bansal, S., Markondeya Raj, P., Shinotani, K., Bhattacharya, S., Tummala, R., Lance, MJ, “Reliability assessment of high density multi-layer board assembly using shadow Moire and luminescence spectroscopy ” Electronics Packaging Technology Conference, 2002. 4th, 126-132, 2002
  • Windlass, H., Markondeya Raj,, Balaraman, D., Bhattacharya, S.K., Tummala, R.R., “Processing of polymer-ceramic nanocomposites for system-on-package applications” Electronic Components and Technology Conference, 2001. Proceedings., 51st, pp. 1201-1206, 2001
  • Markondeya Raj, P., Shinotani, K., Seo, M., Bhattacharya, S., Sundaram, V., Zama, S., Lu, J., Zweben, C., White, G.E., Tummala, R.R., ” Selection and evaluation of materials for future system-on-package (SOP) substrate ” Electronic Components and Technology Conference, Proceedings., 51st, 1193-1197, 2001
  • Banerji, S., Markondeya Raj, P., Shinotani, K.I., Seo, M., Zweben, C., Bhattacharya, S.K., Tummala, R.R., ” Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates “, IMAPS – International symposium on High-Density Interconnects, Santa Clara, CA, 279-284, 2001
  • Tummala, R.R., Raj, P.M., and Mani, R., “Ceramics for IT”, Proceedings of International Society for Advanced Ceramics, ISAC., Indian Ceramic Society, 2001, pp. 1-15.
  • Tummala, R.R., Shintotani, K., Sundaram, V., Bhattacharya, S., White, G., Liu, F., Raj, P.M., Wan, L., Lee, S.H., Ravi, D., “What is the future of electronics? Is it SOP or SOC”, Invited Paper in ICEP 2001 Conference Japan, April 2001
  • Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., “Colloidal processing of nanosized ceramic-polymer composites for integral capacitor applications”, Proceedings, IMAPS, pp. 393-398, International symposium on packaging materials, processes and interfaces, Chateau Elan, Braselton, GA, 2001
  • Raj, P.M., Bhattacharya, S.K., Zweben, C., Zama, S., Shinotani, K., Tummala, R.R., “Selection and evaluation of materials for future system-on-package substrate”, Proceedings, International Council of Electronic Packaging, ICEP, Japan. pp. 382-387, 2001
  • Bhattacharya, S.K., Morales, H., Raj, P.M., Shinotani, K., Tummala, R.R., “An Alternative method for thin polymer coating on large area sop substrates”, Proceedings of INTERPACK’01 The Pacific/RIM ASME International Electronics Packaging, Technical conference and Exhibition, Hyatt Regency Hotel, July 8-13, Kauai, USA, 2001
  • Raj, P.M., SHINOTANI, K.I., AGARWAL, H., WHITE, G.E., TUMMALA, R.R., ” Evaluation of carbon-filled polymer composites for future base substrate and integral resistor applications “, IMAPS 33rd International Symposium on Microelectronics, Boston, 351-356, 2000
  • Markondeya Raj, P. M, Windlass, H., Shinotani, K.I., Bhattacharya, S.K., Sundaram, V., Tummala, R.R., ” Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on MCM-L compatible substrates ” Electronic Components and Technology Conference, Proceedings. 50th, 1681-1685, 2000
  • Windlass, H., Raj, P.M., Bhattacharya, S.K., and Tummala, R.R., “Optimized suspension formulations for improved yield and dielectric properties of ceramic-polymer nanocomposites for integral passives”, Proceedings, IMAPS, Advanced Technology Workshop on Integral Passives, Denver, Colarodo, April 28-30, 2000
  • Raj, P.M., Agarwal, H., Shinotani, K., White, G.E., and R. R. Tummala., “Evaluation of carbon-filled composite materials for future base substrate and integral resistor applications”, IMAPS 33rd International Symposium on Microelectronics, Boston, September 22-24, pp. 351-356, 2000
  • Raj, P.M., Cosandey, F., Cannon, WR, Mainwaring, P., “Particle orientation and texture formation in tape cast ceramic materials ” ICOTOM 12: 12 th International Conference on Textures of Materials, 1476-1481, 1999