Biomedical Device Design:
Biomedical device applications range from health monitoring, implantables for neuromodulation and functional restoration, artificial organs, prosthetics and electroceuticals. Such systems are derived from a diverse set of technologies such as: highly-miniaturized 3D device integration with interconnects; wireless communication; power telemetry and conversion; and reliable neural interfaces that perform functions such as neural stimulation or recording. The electronics should also be compatible with the biological environment they are implanted in. All these system requirements are addressed through upfront design for performance, manufacturing and reliability, which is the main focus of this course. Students who are interested in the development of next-generation biomedical devices and their fabrication and manufacturing will find this knowledge extremely valuable.
This course will cover the fundamentals to rationally design and fabricate such bioelectronics systems. The key topics are:
- Applications of medical devices – system analysis and decision-making
- Design integration with physiological and biocompatibility constraints,
- Design for reliability and manufacturability
- Flexible biocompatible substrates and electronic system integration
- Power supply and conversion
- Hermetic packaging
- Reliability characterization, validation strategies and failure analysis.
Bioelectronic Packaging:
Bioelectronics require a new class of customized packaging technologies to meet its complex functionality and reliability requirements along with surgical constraints. As electronics move close to the neural interfaces in order to cure complex neurodegenerative diseases, the system packages should support a unique and diverse set of requirements to support high-density device integration and reliable neural interfaces that perform functions such as neural stimulation or recording. This course will cover the fundamentals to rationally design and fabricate such bioelectronics systems. The applications for implantable electronics and their system design and form-factor requirements will be discussed first. Device integration for distal implantable packages through various hermetic 3D packaging technologies and their role in bioelectronics will be covered in the second part. Fundamentals of flexible biocompatible substrate packaging to support high-density signal interconnections will be a key topic in this part. Strategies for energy storage and power supply will also be reviewed. The third part of the course covers the fundamentals of reliability and biocompatible packaging. Mathematical models to design for reliability will be discussed. Hermetic packaging, biocompatible neural or tissue interfaces and reliability characterization and validation strategies will be covered in the last part.